Film formation method
A film-forming method and film-forming technology, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as the inability to confirm the change of gas pressure and the change of film thickness
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[0019] figure 1 It is a sectional view showing part of a vertical heat treatment apparatus as a film formation apparatus for semiconductor processing according to an embodiment of the present invention. Such as figure 1 As shown, a vertical heat treatment apparatus 10 has a reaction tube 12 made of, for example, quartz and plugged at the upper end. In the reaction tube 12, a plurality of, for example, 150 semiconductor wafers W (product wafers) serving as substrates are placed on the wafer carrier 13 as a holder in a shelf shape at regular intervals up and down in a horizontal state. The wafer carrier 13 is held by the lid body 14 via a thermal insulation cylinder (heat insulator) 15 .
[0020] The lid body 14 is placed on a carrier elevator 16 for carrying the wafer carrier 13 into or out of the reaction tube 12 . When at the upper limit position, the lid body 14 has the function of closing the lower end opening of the processing container constituted by the reaction tube ...
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Abstract
Description
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Application Information
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