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Light emitting element with metal base composite material carrier

A composite material and metal matrix technology, which is applied in the direction of electrical components, semiconductor devices, laser components, etc., can solve the problems of peeling off metal substrates and light-emitting laminates

Inactive Publication Date: 2005-08-10
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the problem of peeling between the metal substrate and the light-emitting stack in the existing structure will be solved

Method used

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  • Light emitting element with metal base composite material carrier
  • Light emitting element with metal base composite material carrier

Examples

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Embodiment Construction

[0021] see figure 1 According to a preferred embodiment of the present invention 1, a light-emitting element 1 with a metal matrix composite material carrier includes a metal matrix composite material carrier 10, wherein the metal matrix composite material carrier is filled with a suitable metal matrix in a carrier with holes, The thermal expansion coefficient of the metal matrix composite material carrier is close to the thermal expansion coefficient of a luminescent laminate; a metal reflective layer 11 formed on the metal matrix composite material carrier; a transparent bonding layer 12 formed on the metal reflective layer; forming A transparent conductive layer 13 on the transparent adhesive layer, wherein the upper surface of the transparent conductive layer includes a first surface area and a second surface area; a light emitting stack 14 formed on the first surface area; a first wiring electrode 15 formed on the second surface area; and a second wiring electrode 16 form...

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Abstract

The luminous element includes following parts: carrier of metallic matrix structural composite possessing adjustable heat transfer coefficient or thermal-expansion coefficient, a bonding layer formed on the carrier, and a laminated luminescence layers on the said bonding layer.

Description

technical field [0001] The invention relates to a light-emitting element, in particular to a light-emitting element with a metal matrix composite material carrier. Background technique [0002] Light emitting devices are widely used, for example, in optical display devices, laser diodes, traffic signs, data storage devices, communication devices, lighting devices, and medical devices. [0003] Traditional light-emitting elements are mainly made of semiconductors, which have poor thermal conductivity. When the light-emitting element is powered on, the light-emitting element emits light, which will generate heat. Since the light-emitting element is made of semiconductor material, the heat conduction is not good. If the heat cannot be removed properly, the light-emitting element will reduce the luminous efficiency due to heat. , For materials composed of AlGaInP, under the same current conditions, when the external temperature rises from 20°C to 80°C, the brightness will drop ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01S5/00
Inventor 谢明勋刘文煌
Owner EPISTAR CORP
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