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Board through-hole working method

A processing method and plate through-hole technology are applied in metal processing, metal processing equipment, metal processing machine parts, etc., which can solve the problems of wearing and grinding the drill bit 204, and not openly process through holes, etc., and achieve the effect of stable shape

Inactive Publication Date: 2005-09-28
TE CONNECTIVITY GERMANY GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the hard glass substrate 201 is processed with the grinding bit 204 in order to form the bevel 203a, the grinding bit 204 may be worn out.
[0014] In addition, in the through-hole processing method disclosed in the Japanese utility model application Showa No.S58-129663, there is no specific method for processing the through-hole, so whether the through-hole coated with a film can be properly beveled, that is, whether it can be completed The bevel is questionable where the bevel is used in the Figure 8A , 8B and 8C, when the press-fit contact 101 is inserted into the plated through-hole 301, the metal plating applied to the surfaces of the outer edge portions 109 and 110 of the press-fit contact 101 is prevented from peeling off

Method used

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Examples

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Embodiment Construction

[0036] Next, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 is a left side view showing the through-hole processing apparatus applied to the board through-hole processing method of the present invention. Figure 2 is figure 1 The front view of the through-hole processing device shown in . image 3 yes figure 1 A partial left side view of the body portion of the through-hole machining device is shown.

[0037] exist Figure 1 to Figure 3 Among them, the through hole processing device 1 includes a positioning part 10 for positioning a circuit board PCB and a through hole 50 formed on the circuit board PCB by beveling (see Figure 4 ) beveled portion 20.

[0038] The positioning part 10 includes a guide rail part 12 fixed on the surface of the base frame 11 with screws 14, and image 3 The base 13 that moves along the rail portion 12 in the direction of the middle arrow (x direction). Another guide rail part 15 u...

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PUM

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Abstract

The objective of the invention is to provide a circuit board through-hole processing method whereby through-holes can be formed to the circuit board in a way that no metal plating is exfoliated from the through-holes in the case of inserting a press-fit contact to them while suppressing the wear amount of a tool to the utmost. The circuit board through-hole processing method processes through-holes in a drilling manner formed to the printed circuit board PCB and to each of which a press-fit contact 101 formed with a conductor 51 is inserted. The method includes a step of applying chamfering processing to corner edges of each through-hole 50 after the conductor 51 is formed. The chamfering processing is executed by depressing a tool 37 with a sharp head.

Description

technical field [0001] The present invention relates to a board through-hole machining method for machining through-holes (for insertion of press-fit contacts) which are drilled in a circuit board and which have conductors. Background technique [0002] In the past, for example, as Figure 8A , 8B The press-fit contacts 101 shown in and 8C (see Japanese Patent Application No. S61-110979), have been used as contacts of multi-pole connectors used in communication equipment or the like, and this Press fit contacts 101 have been connected to through holes formed on the circuit board. And, for example, recently, it has been desired to use the press-fit contacts 101 as contacts of connectors for automotive control units. This is because no soldering is required when the press-fit contacts 101 are connected to the through holes formed on the circuit board; therefore, the operation of connecting the contacts will be simplified, and any such problems as soldering by the circuit can...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42B23Q15/00F16B13/04H01R12/55H05K1/11H05K3/00H05K3/04
CPCH05K2203/0195H05K2201/0382H05K2201/09827H05K2201/1059H05K3/42H01R12/58Y10T29/49153Y10T29/49155Y10T29/49156Y10T29/5307Y10T29/53174B26F1/12B26F2210/08
Inventor 池田优司丸山清实山上英久川原勇三
Owner TE CONNECTIVITY GERMANY GMBH