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Manufacture of semiconductor chip installing body and the said installing body

A chip mounting and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as hardening

Inactive Publication Date: 2005-10-12
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of a large amount of resin, the resin diffuses around the semiconductor chip and hardens unnecessary areas, or the height of the cured resin exceeds the required height and exceeds the height of the prepared space. bad condition of limitation

Method used

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  • Manufacture of semiconductor chip installing body and the said installing body
  • Manufacture of semiconductor chip installing body and the said installing body
  • Manufacture of semiconductor chip installing body and the said installing body

Examples

Experimental program
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Effect test

Embodiment Construction

[0020] Embodiments of the present invention will be described with reference to the accompanying drawings, which are provided for illustrative purposes only and in no way limit the present invention.

[0021] As an embodiment of the present invention, after the step of sealing the semiconductor chip, a step of heating the underfill resin and the thermosetting resin sheet until final curing may be provided. The final curing of the underfill resin and the thermosetting resin sheet can be performed simultaneously. Furthermore, productivity can be improved by performing them separately.

[0022] In addition, as an embodiment, the above-mentioned step of arranging a thermosetting resin sheet having a larger area than the exposed surface on the exposed surface of the above-mentioned flip-chip connected semiconductor chip may also use a cartridge capable of vacuum absorbing the above-mentioned thermosetting resin sheet. The process of heating the above-mentioned thermosetting resin ...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To provide a process for producing a semiconductor chip mounting body having a semiconductor chip and a wiring board, and to cover the semiconductor chip with resin of intended shape in the semiconductor chip mounting body thus produced.SOLUTION: The process for producing a semiconductor chip mounting body comprises a step for assembling the mounting body of a semiconductor chip such that the gap between a wiring board and the semiconductor chip is filled with underfill resin and the semiconductor chip is flip-chip connected on the wiring board, a step for arranging a thermosetting resin sheet having an area larger than that of the exposed surface of the flip-chip connected semiconductor chip on the exposed surface, and a step for heating the thermosetting resin sheet arranged on the exposed surface of the semiconductor chip and sealing the semiconductor chip with the thermosetting resin sheet to cover the exposed surface.

Description

[0001] related application [0002] This application is based on the benefit of priority of Japanese Patent Application No. 2004-116271 filed on April 9, 2004. The interests of its priority are thereby asserted. The entire contents of the aforementioned Japanese application are hereby incorporated by reference. technical field [0003] The present invention relates to a method of manufacturing a semiconductor chip package having a semiconductor chip and a wiring board and a semiconductor chip package manufactured by the manufacturing method, and more particularly to a semiconductor chip package in which a semiconductor chip is flip-chip connected to a wiring board A manufacturing method and a semiconductor chip package. Background technique [0004] In order to reduce the mounting area or improve electrical performance, a mounting method is used in which a semiconductor chip is flip-chip connected on a wiring board. In particular, the tendency is strong in portable equipm...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/50H01L21/56H01L23/12H01L23/28
CPCH01L2224/92125H01L2224/83192H01L2224/16225H01L2224/32225H01L2224/73204
Inventor 青木慎细田邦康
Owner KK TOSHIBA