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Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same

A technology for electrical contact terminals and circuit components, which is applied to printed circuits connected to non-printed electrical components, and assembling printed circuits with electrical components.

Active Publication Date: 2005-11-23
COMCHIP TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the impedance characteristics of its conductive path are adequate for small signal applications, it is not suitable for high power applications

Method used

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  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same
  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same
  • Flat sheet type packaging of circuit assembly having metal block shaped electric contact terminal and method for making the same

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Experimental program
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Embodiment Construction

[0026] figure 1 It shows a perspective view of the crystal grain surface of the substrate used to manufacture the circuit assembly of the preferred embodiment of the circuit assembly planar package of the present invention. As shown in the figure, the substrate 100 used to carry the entire matrix arrangement, typically up to hundreds of discrete circuit components, has multiple sets of initial conductive lines 111A of pairs of discrete circuit components on the surface of the grain surface 110, 111B, 112A, 112B, . . . and 116A, 116B, etc. are arranged in a two-dimensional orthogonal matrix as shown in the figure. Note that the substrate 100 itself, at this early stage of the fabrication process, is also used as a base carrier for a large number of circuit assemblies produced in batches according to the present invention.

[0027] figure 1 The substrate shown is used as the basis of the discrete circuit assembly of the present invention. The entire substrate is a plate with g...

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PUM

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Abstract

This invention discloses one wireless lead leg plat sealing in circuit elements, which comprises one flat sealed body and at least two electrical contact terminal, wherein, flat sealed body comprises water and gas tight sealed materials and circuit elements at least one circuit element transistor; the terminals are connected to relative circuit joints of circuit element particles and each terminal comprises one level welding surface welded on the outer surface; the level tin surface can weld the terminal on one printing circuit board cushions on the printing circuit board.

Description

technical field [0001] The present invention is generally related to the package of circuit components (circuit components), especially to a contact terminal suitable for low-cost, high-efficiency automated mass production, with good electrical conductivity and good heat dissipation properties, suitable for Flat Package for high power circuit components. Background technique [0002] Active and passive circuit components such as diodes, transistors, resistors and capacitors are circuit components widely used in electronic circuits. Whether it is for small signal (signal) or high power (power), linear (linear) or digital (digital) circuits, all need to be applied to these discrete circuit components of different nature. In addition to the diodes, resistors, and capacitors integrated in integrated circuits, the diodes, resistors, and capacitors in the form of discrete components are the most widely used electronic components. [0003] There are many types of packaging for di...

Claims

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Application Information

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IPC IPC(8): H05K1/18
Inventor 陈文隆胡志良陈炳南梁明忠
Owner COMCHIP TECH