Compositions and methods for scintillator arrays

Abstract

A composition including at least one of a glass composition and a glass ceramic composition, the composition includes a plurality of scintillator crystals.

Description

technical field [0001] The present invention relates generally to computed tomography (CT) systems, and more particularly to CT scintillator arrays employing glass and glass-ceramic fibers. Background technique [0002] The CT system uses a scintillator detector to convert the received X-ray intensity into an electrical signal. The scintillator detector consists of a scintillator and a photodiode that are closely coupled to each other. The scintillator is emitted by the interaction of ionizing radiation such as X-rays. A substance that emits visible or ultraviolet light. The light thus emitted is detected by a photodetector and converted into an electrical signal. [0003] Such scintillation detectors in a CT system are arranged in an array of scintillators called a pack. The stack is arranged to capture the different picture elements (hereinafter referred to as pixels) of the desired scanned image. The scanned image The resolution of the stack is directly related to the si...

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Problems solved by technology

[0004] This brings various complications to the process of building this type of stack. The first challenge is the alignment of the pixels. Fine spacing between pixels is useful to allow the use of castable or other types of Reflectors. Alignment between the collimator and the stack is also required. Misalignment with the collimator may cause stringing and other problems that generate artifacts. The technical conditions for misalignment between the collimator and the stack are strictly Limitation to maintain acceptable image quality. This limiting specification for misalignment results in the use of thick tungsten plates that reduce the metrology efficiency of the detector. Tungsten plates eliminate scattered X-rays, thereby reducing image noise and improving contrast. Tungsten plates Also reduces X-ray punch-through, which causes noise and radiation damage in the photodiode. Another challenge is the alignment between the stack and the photodiode. Misalignment between the stack and the photodiode can cause pixel This misalignment can also cause noise generated by X-rays and radiation damage to the photodiode.

[0005] Due to the strict construction requirements mentioned above, the manufacturing process of the stack becomes very expensive. Moreover, the limitations in the design of these stacks limit their range of applications. For example, the resolution of images scanned by a CT system is limited by the stack used in the CT system. Stack design constraints.

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