Surface mounting method for electronic element and printed circuit board applying same mounting method

A technology for printed circuit boards and electronic components, which is applied in the field of assembly process of electronic components, can solve the problems of poor contact between solder balls and pads, and high welding defect rate between graphics cards and printed circuit boards, and achieves increased welding reliability and good contact. Effect

Inactive Publication Date: 2006-01-18
MITAC COMP (SHUN DE) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this kind of double-sided surface mount (SMT) process, when the solder paste on the board surface is cooled and then slightly melted when it passes through the reflow furnace during the bottom process, it may itself be damaged under the action of thermal stress. This leads to poor contact between the solder ball and the pad, and if there are heavy electronic components mounted on the board, su

Method used

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Examples

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Example Embodiment

[0011] In the following, a graphics card with heat sink (ATI VGA) is taken as an example to illustrate the mounting method of the present invention and the printed circuit board manufactured according to the mounting method.

[0012] The surface mounting method of this embodiment includes a board surface process and a board bottom process.

[0013] Among them, the board surface manufacturing process includes: blank board baking; board surface solder paste printing; dispensing glue on the board surface where the graphics card with heat sink needs to be mounted. The present invention is to install the graphics card with heat sink around points Apply black glue, which is more viscous and has a better effect than red glue; board surface patch, that is, install the corresponding electronic components on the board surface, including the graphics card with heat sink; hand parts; middle position inspection; Reflow furnace; visual inspection;

[0014] The bottom-of-board manufacturing proc...

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PUM

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Abstract

This invention relates to a surface furring method of a special electrical element, in addition to a printed circuit board made by the method, characterized in that it daubs some glue in the point where needs to stick the special electrical element, preventing the worse welding because of gravity function of the electrical element, which increases the reliability of the welding between the special electrical element and the print circuit board.

Description

technical field [0001] The invention relates to an assembly process of electronic components, in particular to a surface mount (SMT) method of electronic components and a printed circuit board manufactured by using the method of mounting and mounting. Background technique [0002] Some printed circuit boards require a double-sided surface mount (SMT) process, including the board process and the bottom process. [0003] The board surface process includes: empty board baking; board surface solder paste printing; board surface patching, that is, attaching corresponding electronic components on the board surface; hand placing parts; intermediate position inspection; reflow oven; visual inspection; [0004] The process of the bottom of the board includes: turning the printed circuit board over and printing the solder paste on the bottom of the board; mounting the bottom of the board, that is, attaching the corresponding electronic components on the bottom of the board; placing th...

Claims

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Application Information

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IPC IPC(8): H05K3/34H05K3/32H05K1/18
Inventor 袁明强温亮翟建兵
Owner MITAC COMP (SHUN DE) LTD
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