Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface mounting method for electronic element and printed circuit board applying same mounting method

A technology for printed circuit boards and electronic components, which is applied in the field of assembly process of electronic components, can solve the problems of poor contact between solder balls and pads, and high welding defect rate between graphics cards and printed circuit boards, and achieves increased welding reliability and good contact. Effect

Inactive Publication Date: 2006-01-18
MITAC COMP (SHUN DE) LTD
View PDF0 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this kind of double-sided surface mount (SMT) process, when the solder paste on the board surface is cooled and then slightly melted when it passes through the reflow furnace during the bottom process, it may itself be damaged under the action of thermal stress. This leads to poor contact between the solder ball and the pad, and if there are heavy electronic components mounted on the board, such as a graphics card with a heat sink (ATIVGA), since the bottom of the board is processed through the reflow furnace, the board faces downward, and the heat sink The graphics card is heavy, so under the action of gravity, it will lead to poor contact between the solder ball and the pad, so that the soldering defect rate between the graphics card with heat sink and the printed circuit board is very high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The video card with heat sink (ATI VGA) is still taken as an example below to illustrate the mounting method of the present invention and the printed circuit board manufactured according to the mounting method.

[0012] The surface mount method of this embodiment includes a board surface manufacturing process and a board bottom manufacturing process.

[0013] Among them, the board surface manufacturing process includes: empty board baking; board surface solder paste printing; dispensing glue on the board surface where the graphics card with heat sink needs to be attached. Apply black glue, this kind of glue is more viscous, and the effect is better than red glue; board surface patch, that is, attach corresponding electronic components on the board surface, including graphics cards with heat sinks; hand place parts; middle position inspection; pass reflow oven; visual inspection;

[0014] The process of the bottom of the board includes: turning the printed circuit board...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to a surface furring method of a special electrical element, in addition to a printed circuit board made by the method, characterized in that it daubs some glue in the point where needs to stick the special electrical element, preventing the worse welding because of gravity function of the electrical element, which increases the reliability of the welding between the special electrical element and the print circuit board.

Description

technical field [0001] The invention relates to an assembly process of electronic components, in particular to a surface mount (SMT) method of electronic components and a printed circuit board manufactured by using the method of mounting and mounting. Background technique [0002] Some printed circuit boards require a double-sided surface mount (SMT) process, including the board process and the bottom process. [0003] The board surface process includes: empty board baking; board surface solder paste printing; board surface patching, that is, attaching corresponding electronic components on the board surface; hand placing parts; intermediate position inspection; reflow oven; visual inspection; [0004] The process of the bottom of the board includes: turning the printed circuit board over and printing the solder paste on the bottom of the board; mounting the bottom of the board, that is, attaching the corresponding electronic components on the bottom of the board; placing th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34H05K3/32H05K1/18
Inventor 袁明强温亮翟建兵
Owner MITAC COMP (SHUN DE) LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com