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Releasable adhesive composition

A technology of adhesives and compositions, applied in the direction of adhesive types, film/sheet adhesives, ester copolymer adhesives, etc., can solve the problems of not developing peelable adhesives, etc.

Inactive Publication Date: 2006-05-10
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, such a peelable adhesive that can provide the above characteristics and excellent reworkability has not yet been developed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] In a 1 L glass reactor, 95 parts of 2-ethylhexyl acrylate and 5 parts of polar monomer acrylic acid were partially polymerized by heating to obtain a polymer slurry having a viscosity of 2000 cPs. As used in the examples, the term "parts" means parts by weight based on 100 parts by weight of the adhesive polymer resin. 0.2 parts of Irgacure-651 (α, α-methoxy-α-p-hydroxyacetophenone) as a photoinitiator and 0.65 parts of 1 as a crosslinking agent were added to 100 parts of the obtained polymer syrup, 6-hexanediol diacrylate (HDDA), then stir the mixture well.

[0059] Next, to the mixture were added 100 parts of aluminum hydroxide having a particle diameter of about 70 μm as a thermally conductive filler and 10 parts of crystalline powdery 3-(hydroxyphenyl oxide having a melting point of 158° C. Phosphino)propionic acid (C 9 h 11 o4 P), then stir the mixture well until it becomes homogeneous. The mixture was defoamed under reduced pressure by a vacuum pump, and then ...

Embodiment 2

[0061] Except using 20 parts instead of 10 parts of crystalline powdered 3-(hydroxyphenylphosphinyl)propionic acid (C 9 h 11 o 4 Except for P), a thermally conductive adhesive sheet was obtained in the same manner as in Example 1.

Embodiment 3

[0063] In addition to using 20 parts of 9,10-dihydroxy-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO; C 12 h 9 o 2 Except for P), a thermally conductive adhesive sheet was obtained in the same manner as in Example 1.

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Abstract

The present invention relates to an adhesive composition comprising an adhesive polymer resin and an organic compound having a melting point higher than the maximum acceptable operating temperature of the product in which the adhesive is used, and an adhesive sheet prepared therefrom. crystal material. The adhesive composition and adhesive sheet of the present invention maintain excellent adhesive strength at their use temperature, and exhibit a rapid decrease in tack at a temperature higher than the melting point of the organic crystalline material to release it from the substrate.

Description

technical field [0001] The present invention relates to a peelable adhesive composition, and more particularly to an adhesive composition that is readily peelable at temperatures above the maximum acceptable operating temperature of the product in which the adhesive is used, and consists of Adhesive sheets which are prepared. Background technique [0002] With the development of the IT industry, various electrical and electronic products including display products are often composed of various materials. These electric or electronic products are generally produced by combining materials such as metals, ceramics, and plastics, and in order to assemble these materials into products, adhesives having various thicknesses and properties are used so that these materials function smoothly. In order for the materials to be bonded to realize their inherent functions smoothly, in addition to bonding these materials with each other, adhesives applied to electronic products sometimes n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/10C08G63/02C09J7/00C09J7/02C09J11/00C09J133/00C09J133/02C09J133/12
CPCC08K5/5317C09J11/00C09J133/02C09J133/06Y02P20/582C08K3/013C09J7/385C09J133/10
Inventor 金章淳金佑河李在官张锡基金旭李根熙李炳守
Owner LG CHEM LTD