Cooler, heat sink and electronic apparatus

A technology for radiators and cooling equipment, applied in the direction of cooling/ventilation/heating transformation, circuits, electrical components, etc., can solve the problems of increasing heat dissipation, achieve the effects of reducing exhaust volume, easy formation, and reduced production costs

Inactive Publication Date: 2008-04-23
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it is impossible to increase the heat dissipation

Method used

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  • Cooler, heat sink and electronic apparatus
  • Cooler, heat sink and electronic apparatus
  • Cooler, heat sink and electronic apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0068] 1 is a perspective view of a cooling device according to a first embodiment of the present invention, FIG. 2 is a sectional view along line A-A of FIG. 1, and FIG. 3 is a perspective view of a radiator.

[0069] (Structure of cooling equipment)

[0070] The cooling device 1 includes a spray generating mechanism 2 that discharges a pulsating flow of gas, and a radiator 3 that receives the gas discharged from the spray generating mechanism 2 , as shown, for example, in FIG. 1 .

[0071] The ejection generating mechanism 2 includes, for example, a housing 4 containing gas, and a vibrating plate 5 as a vibrating body vibratingly installed in the housing.

[0072] For example, as shown in FIG. 1 , a plurality of first nozzles 6 serving as first openings, and a plurality of second nozzles 7 serving as second openings are provided on one side 4 a of the case 4 . The first and second nozzles 6 and 7 discharge the air used as gas contained in the housing 4 toward the radiator 3...

no. 2 example

[0120] Fig. 9 is a perspective view of a heat sink according to a second embodiment of the present invention.

[0121] This embodiment differs from the first embodiment in that the partition sheet is connected to the radiation sheet of the heat sink. Therefore, the description below will focus on this difference.

[0122] The heat sink 103 includes a plurality of radiating fins 20 which receive air as exhaust gas from the ejection generating mechanism 2; heat pipes 21 as heat conduction members which transfer heat from a heat source to the radiating fins 20; The midpoint between the two nozzles 6 and 7 is, for example, as shown in FIG. 9 .

[0123] The partition sheet 130 is disposed on the side of the radiation sheet 20 receiving gas exhausted from the injection generating mechanism 2 and between the first and second nozzles 6 and 7 of the injection generating mechanism 2 . The partition piece 130 extends in a direction substantially orthogonal to a straight line connecting...

no. 3 example

[0147] Fig. 12 is a perspective view of a heat sink according to a third embodiment.

[0148] This embodiment differs from the first embodiment in that the heat pipe of the heat sink does not extend through the radiation sheet, but is arranged on the face of the curved side portion 23a or 23b of the radiation sheet. Therefore, the description below will focus on this difference.

[0149] The heat sink 203 includes a plurality of radiation fins 20 which receive air as exhaust gas from the injection generating mechanism 2; heat pipes 221 which serve as heat conduction members which transfer heat from a heat source to the radiation fins 20; The partition piece 130 between and 7 is, for example, as shown in FIG. 12 .

[0150] The heat pipe 221 is partially welded and thermally connected to the face of the curved side portion 23a of the radiation sheet 20, for example, as shown in FIG. 12 .

[0151] Since the cross section of the heat pipe 221 is substantially elliptical, the con...

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Abstract

A cooler dissipating heat generated from a heat generating source effectively while suppressing generation of noise by suppressing ejection volume of gas, a heat sink, and an electronic apparatus mounted with them. The heat sink (3) is provided with cuts (24a, 24b) capable of taking in gas, i.e. air, from the external, on the side for receiving air ejected from first and second nozzles (6, 7) as the openings of a jet generation mechanism (2). Consequently, pressure is lowered in the vicinity of the cuts by the air flow ejected from the first and second nozzles (6, 7) and external air is sucked from the cuts (24a, 24b). Since a larger quantity of gas than that ejected from the first and second nozzles (6, 7) is discharged from the outlet of the heat sink, generation of noise is suppressed by suppressing the ejection volume as much as possible and the heat generated from the heat generating source can be dissipated effectively.

Description

technical field [0001] The present invention relates to a cooling device and a heat sink that radiate heat generated from a heat source, and to an electronic device in which the cooling device and the heat sink are installed. Background technique [0002] As the performance of PCs (Personal Computers) increases, heat generated by heat generating elements such as ICs (Integrated Circuits) increases. This increase in heat is a problem. Therefore, various heat radiation techniques have been proposed and put into commercial use. For example, one way to radiate heat is to place a heat sink made of metal, such as aluminum, in contact with the IC so that heat is transferred from the IC to the heat sink. Another way of heat radiation is to use a fan to forcibly remove the hot air in, for example, the casing of a PC, so as to direct the external low-temperature air to the surroundings of the heating element. In another approach, both heat sinks and fans are used. When the contact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/467H01L23/36H05K7/20
Inventor 牧野拓也泷野浩堀和仁石川博一
Owner SONY CORP
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