Photosensitive resin composition and dry film resist using the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGJIN SEMICHEM CO LTD
- Publication Date
- 2006-06-07
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to an alkali-soluble photosensitive resin composition and a dry film resist using the photosensitive resin composition, more particularly, to a photosensitive resin composition for etching a Cu substrate or an ITO substrate and using the photosensitive resin composition Composition of dry film resists. Background technique
[0002] With the recent high integration of electronic equipment, the demand for highly integrated circuits with narrow wiring and insulating region patterns is increasing. And, demand for dry film resists having excellent heat resistance, chemical resistance, and long-term stability is also increasing.
[0003] Conventional dry film resists are limited in adhesion and solubility to substrates. In order to overcome these problems, viscosity enhancers such as silane coupling agents are used.
[0004] However, since the viscosity enhancer itself is unstable, it tends to impair the storage stability of ...