Photosensitive resin composition and dry film resist using the same

A technology of photosensitive resin and composition, which is applied in the field of dry film resist and alkali-soluble photosensitive resin composition, can solve the problems of destroying the storage stability of the composition, instability of the viscosity enhancer, etc., achieve excellent storage stability, improve High effect of adhesion, heat resistance and chemical resistance

Inactive Publication Date: 2006-06-07
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the viscosity enhancer itself is unstable, it tends to destroy the storage stability of the composition

Method used

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  • Photosensitive resin composition and dry film resist using the same
  • Photosensitive resin composition and dry film resist using the same
  • Photosensitive resin composition and dry film resist using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 and 2

[0043] (Preparation of polymer resin)

[0044] According to the components and contents shown in Table 1 below, acrylate copolymer resins represented by Chemical Formula 1 (Preparation Examples 1 and 2), and conventionally used acrylate copolymer resins (Comparative Preparation Examples 1 and 2) were prepared. ). 70 wt% tetrahydrofuran (TFH) was used as a polymerization solvent. Polymerization was performed at 45°C using a low temperature initiator.

[0045] Classification

[0046] In Table 1, BM stands for benzyl methacrylate; MA stands for methacrylic acid; PAM-100 and PAM-200 are phosphate-containing methacrylates prepared by RHODIA; HEMA stands for 2-hydroxyethyl methacrylate ester; and MMA stands for methyl methacrylate.

Embodiment 1～5 and comparative Embodiment 1～3

[0048] (Preparation of Photosensitive Resin Composition)

[0049] The cross-linking monomer, photopolymerization initiator, dye and colorant were added to the acrylate copolymer resin, and Table 2 below shows the respective compositions and contents. After the components were dissolved, the mixture was stirred at room temperature for 2 hours, thereby obtaining a photosensitive resin composition. The resulting photosensitive resin composition was filtered with a 500-mesh filter, thereby removing impurities.

[0050] Classification (wt%)

Example

comparative example

1

2

3

4

5

1

2

3

Tree

fat

Preparation Example 1

30

-

32

-

15

-

-

-

Preparation Example 2

-

30

-

32

15

-

-

-

Comparative Preparation Example 1

-

-

-

-

-

30

- ...

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PUM

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Abstract

The present invention relates to an alkali-soluble photosensitive resin composition and a dry film resist using the photosensitive resin composition, and more particularly to a resist having excellent heat resistance by including an acrylate resin effective for improving adhesion. , chemical resistance, and long-term stability, and a photosensitive resin composition having excellent adhesion to Cu or ITO (indium tin oxide) substrates, and a photosensitive dry film resist using the photosensitive resin composition.

Description

technical field [0001] The present invention relates to an alkali-soluble photosensitive resin composition and a dry film resist using the photosensitive resin composition, more particularly, to a photosensitive resin composition for etching a Cu substrate or an ITO substrate and using the photosensitive resin composition Composition of dry film resists. Background technique [0002] With the recent high integration of electronic equipment, the demand for highly integrated circuits with narrow wiring and insulating region patterns is increasing. And, demand for dry film resists having excellent heat resistance, chemical resistance, and long-term stability is also increasing. [0003] Conventional dry film resists are limited in adhesion and solubility to substrates. In order to overcome these problems, viscosity enhancers such as silane coupling agents are used. [0004] However, since the viscosity enhancer itself is unstable, it tends to impair the storage stability of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039C08F220/06C08F220/18C08F230/02G03F7/033
CPCC08F220/06C08F220/14C08F230/02C08F220/1806G03F7/033G03F7/038B65D85/808B65B29/028
Inventor 金奉玘朴圣模朴赞硕
Owner DONGJIN SEMICHEM CO LTD
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