Ultrasonic wave shock bonding device

Abstract

The supersonic shock coupling device comprises: a shock member with at least one shock generator on end to drive itself and generate high-frequency shock axially, a friction plate arranged on side surface of the shock part with a contact part to contact with and force a wafer waiting for package to bring it generate high-frequency shock and rub with electrode on a substrate to generate atom attraction force for welding the wafer and substrate circuit joint. Wherein, the said friction plate is flat shape and fixed on surface of shock member by screw for replacement. This invention reduces effect of added weight to shock mode and fit to package larger wafer.

Description

technical field [0001] The invention relates to an ultrasonic vibration bonding device, in particular to an ultrasonic vibration bonding device used in semiconductor chip packaging. Background technique [0002] Flip chip packaging adopted by semiconductor chips is a fairly common packaging method at present. The thermal ultrasonic flip-chip bonding technology in flip-chip packaging mainly uses an ultrasonic oscillator to drive the chip to generate high-frequency oscillations relative to the substrate, so that the electrodes on the chip and the substrate rub against each other, and the metal between the contact electrodes generates atomic attraction. Force, so that the electrodes of the wafer and the substrate are welded together. [0003] As shown in Figure 5, it is a schematic diagram of the structure of a conventional ultrasonic oscillation device used for thermosonic flip-chip packaging. This type of ultrasonic oscillation device usually includes: an ultrasonic oscillat...

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Problems solved by technology

[0006] Although the conventional ultrasonic oscillation device used in flip-chip packaging can achieve the purpose of welding the electrodes of the chip and the substrate, there are still quite a few shortcomings in its practical application.

[0007] First of all, the size of the tool head 4 used in the conventional ultrasonic vibration bonding device must match the size and area of ​​the chip 6. Therefore, when the current semiconductor chip is developing towards a large-scale trend in order to accommodate more circuit components, flip-chip The size of the tool head 4 of the ultrasonic oscillating device used in packaging will also increase accordingly. When the size of the tool head 4 increases, the overall weight of the oscillating head 2 will increase, which will increase the difficulty and bottleneck of the overall design of the ultrasonic oscillating device. And it causes the instability of its action, so it is impossible to use a wafer with a large area for bonding.

[0008] In addition, the tool head 4 of the conventional ultrasonic vibrating device is a cylinder passing through the vibrating head 2, and the size of the tool head 4 must match the size of the wafer 6, so when the ultrasonic vibrating device 1 is used for wafers of different sizes During packaging, the size of the tool head 4 must also be changed accordingly, and because the tool head 4 is directly installed inside the hole of the oscillating head 2, the size of the hole for installing the tool head 4 on the oscillating head 2 must be changed, and at the same time Because the weight of the tool head 4 changes, the structure of the whole oscillating head 2 and the oscillating generator 3 must also be changed accordingly, so that the conventional ultrasonic oscillating generating device 1 must be replaced as a whole when used for the packaging of chips of different sizes. Therefore, it is relatively inelastic to use

[0009] The tool head 4 will wear out after being used for a certain period of time due to the friction between it and the wafer 6. However, the tool head 4 of the conventional ultrasonic oscillator device has an integrated structure, so it must be replaced as a whole after it is worn out. , so the increase in its use and maintenance costs

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