Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire

A technology of insulating fixed plate and evaporation source, which is used in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve problems such as weakening of mechanical strength, cracking of heating wires, uneven temperature distribution of crucibles, etc.

Inactive Publication Date: 2006-06-28
伊诺维克斯股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] If the evaporation source is manufactured in a state where the heating wire is damaged as described above, and current flows through said heating wire, the temperature distribution of the crucible will be uneven due to local uneven resistance on the heating wire
If the heating wire is used in this state for a long time, the mechanical strength at the damaged part will be weakened, which may cause the heating wire to crack
[0018] In addition, the aforementioned traditional heating wire fixing device will cover the heating wire by the thickness of the upper and lower insulating fixing plates, so that the radiant heat applied to the crucible is correspondingly reduced

Method used

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  • Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire
  • Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire
  • Evaporation source for deposition process and insulation fixing plate, and heating wire winding plate and method for fixing heating wire

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Embodiment Construction

[0061] Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

[0062] Figure 5 is a perspective view of a linear evaporation source for manufacturing a thin organic semiconductor device according to a first embodiment of the present invention, and Figure 6 yes Figure 5 The side cross-sectional view of the linear evaporation source shown in .

[0063] The crucible 10 has an opening 11 formed at one side thereof. The other side of the crucible 10 is closed to form a storage space. The deposition substance (A) is accommodated in the accommodation space. Preferably, the crucible 10 is processed into a long column shape, and the opening 11 is formed along the length direction of the crucible 10 .

[0064] Here, a thin film can be deposited by moving the crucible 10 over the opening 11 in a direction perpendicular to the length direction or vice versa.

[0065] According to...

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PUM

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Abstract

Disclosed is a linear evaporation source used for forming a thin film for an organic semiconductor device, the linear evaporation source comprising a crucible having a receiving space formed therein, for accommodating an evaporation material and an opening section formed at one side of the crucible in a length direction, wherein the opening section becomes narrow as it travels from both ends to a center portion thereof. If the thin film is formed using the linear evaporation source, a low material use rate of the vacuum evaporation source for the formation of the thin film is improved, thickness uniformity of the deposited thin film throughout the whole area is secured, and shadow effect due to the shadow mask is improved.

Description

technical field [0001] The present invention relates to an evaporation source and an insulating fixing plate for a deposition process, as well as a heating wire winding plate and a method for fixing the heating wire, in particular, relates to an evaporation source for a deposition process, wherein Low material usage is improved and thickness uniformity of the deposited film is ensured over the entire area. [0002] Also, the present invention relates to an insulating fixing plate, a heating wire winding plate, and a method for fixing the heating wire, wherein the heating wire set and fixed on the evaporation source is prevented from being damaged, and the heating wire is easily installed on the evaporation source. around, to evenly apply heat to the evaporation source, which enhances the durability of the heating wire, and reduces the area shaded by the fixing plate for fixing the heating wire, in order to improve efficiency, wherein the evaporation source is used to utilize ...

Claims

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Application Information

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IPC IPC(8): H01L21/20
Inventor 李宰卿金信哲明鲁勋
Owner 伊诺维克斯股份有限公司
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