The invention discloses a super-thick
copper PCB with inner and outer
layers of 6OZ, and a manufacturing method thereof. The PCB is composed of a core board, inner-layer
copper plated on the upper andlower surfaces of the core board, a PP sheet pressed on the inner-layer
copper, and outer-layer copper plated on the PP sheet. The manufacturing method comprises the steps of
cutting, removing smear,plating the full board,
drying the film on the inner layer,
etching the inner layer, AOI detection,
browning,
cutting and filling the PP sheet, laminating, milling the edge of the board, plating thefull board for the second time, drilling a hole, removing
drill smear,
drying the film on the outer layer, plating a pattern,
etching the outer layer, secondary AOI detection,
coating solder, millingthe board and electrical
logging. According to the super-thick copper PCB provided by the invention, the inner-layer copper, the PP sheet and the outer-layer copper are sequentially arranged on the upper and lower surfaces of the core board that is 0.1mm thick to form a laminated structure, so that the overall thickness of the board is controlled to be 1.4-1.6mm, and the thickness uniformity of the PCB is ensured.