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Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus

A substrate inspection and setting method technology, which is applied to measuring devices, optical devices, image data processing, etc., can solve the problems of difficult substrate inspection, high device cost, and large capacity, and achieve simple and high-speed processing and suppression The effect of usage

Active Publication Date: 2006-08-30
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned above, for IC-type components, since the area of ​​the main body of the part is extremely large, when the color of all areas where the main body of the part should be arranged should be carefully inspected, the processing time increases, and it is difficult to realize real-time board inspection
In addition, since it is necessary to configure the entire area of ​​the main body of the part image processing, recording, so the working memory and image The capacity of the storage device becomes large, resulting in an increase in the cost of the device

Method used

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  • Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus
  • Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus
  • Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus

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Experimental program
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Effect test

no. 1 approach

[0068] (Structure of board inspection system)

[0069] figure 1 The hardware configuration of the substrate inspection system according to the embodiment of the present invention is shown.

[0070] The substrate inspection system includes a substrate inspection device 1 that executes substrate inspection processing, and an inspection logic setting device 2 that automatically generates inspection logic used in the substrate inspection process of the substrate inspection device 1 . The substrate inspection device 1 and the inspection logic setting device 2 can be performed via a wired or wireless network, or a recording medium such as MO or DVD. image or transfer of electronic data such as parameters. In addition, in the present embodiment, the substrate inspection device 1 and the inspection logic setting device 2 are separate structures, but the substrate inspection device body may incorporate the function of the inspection logic setting device to form an integrated structu...

no. 2 approach

[0137] In the above-described first embodiment, the misalignment of the IC-based component is inspected focusing on the edge of the component main body portion. However, depending on the type of part, there may be deviation or unevenness in the color distribution of the main part of the part, making it difficult to determine the edge. For example, when characters or symbols are printed on the surface of the component body, or when the surface of the component body is deformed by heating during reflow, etc., color unevenness of the component body may occur. Therefore, in the second embodiment of the present invention, focusing on the fact that a plurality of leads are arranged linearly along the edge in IC components, the straight line connecting the plurality of leads (hereinafter referred to as " The position and angle of the lead alignment line"), thereby checking for component misalignment.

[0138] (Substrate inspection processing)

[0139] First, refer to Figure 12 Th...

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Abstract

Provided is a technique capable of inspecting quickly a shift of an IC component, with a small storage capacity. This method / device stores preliminarily an inspection logic including a color condition for specifying a color appearing in a component body of an inspection objective component, and a determination condition, the inspection objective component is irradiated at different incident angles with a plurality of colors of lights, a reflected lights therefrom are imaged to acquire an inspection image including at least one part of an edge of the component body of the inspection objective component, a component body area satisfying the color condition is extracted from the inspection image by image processing, using the color condition, the edge in the component body area is specified by the image processing, a value of a feature amount of the edge is compared with the determination condition to determine whether the inspection objective component is brought into a normal posture or not.

Description

technical field [0001] The present invention relates to a technique for inspecting misalignment of IC (integrated circuit) components mounted on a substrate, and a technique for generating inspection logic used in the inspection. Background technique [0002] Conventionally, a board inspection device for inspecting the solder mounting quality of a printed board on which a plurality of electronic components is mounted has been proposed. In this type of printed circuit board, the "solder bump shape when soldering the electrode portion of the electronic component and the pad" is called a fillet, but it may appear that a fillet is formed due to the wetting of the electrode portion of the electronic component. In fact, the electronic components and solder pins are not in contact. Therefore, in order to check whether the soldering is good or not, it is necessary to accurately capture the shape of the fillet formed by the free curve. [0003] However, in the existing substrate in...

Claims

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Application Information

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IPC IPC(8): G01N21/956G01N21/88G01R31/309G01B11/24G06T7/00H05K13/08
Inventor 森谷俊洋和田洋贵大西贵子清水敦仲岛晶
Owner ORMON CORP
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