Printed circuit board inspecting method and apparatus inspection logic setting method and apparatus

A substrate inspection and setting method technology, which is applied to measuring devices, optical devices, image data processing, etc., can solve the problems of difficult substrate inspection, high device cost, and large capacity, and achieve simple and high-speed processing and suppression The effect of usage
CN1825100AActive Publication Date: 2006-08-30ORMON CORP
2 Cites 25 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ORMON CORP
Publication Date
2006-08-30

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

Provided is a technique capable of inspecting quickly a shift of an IC component, with a small storage capacity. This method / device stores preliminarily an inspection logic including a color condition for specifying a color appearing in a component body of an inspection objective component, and a determination condition, the inspection objective component is irradiated at different incident angles with a plurality of colors of lights, a reflected lights therefrom are imaged to acquire an inspection image including at least one part of an edge of the component body of the inspection objective component, a component body area satisfying the color condition is extracted from the inspection image by image processing, using the color condition, the edge in the component body area is specified by the image processing, a value of a feature amount of the edge is compared with the determination condition to determine whether the inspection objective component is brought into a normal posture or not.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a technique for inspecting misalignment of IC (integrated circuit) components mounted on a substrate, and a technique for generating inspection logic used in the inspection. Background technique

[0002] Conventionally, a board inspection device for inspecting the solder mounting quality of a printed board on which a plurality of electronic components is mounted has been proposed. In this type of printed circuit board, the "solder bump shape when soldering the electrode portion of the electronic component and the pad" is called a fillet, but it may appear that a fillet is formed due to the wetting of the electrode portion of the electronic component. In fact, the electronic components and solder pins are not in contact. Therefore, in order to check whether the soldering is good or not, it is necessary to accurately capture the shape of the fillet formed by the free curve.

[0003] However, in the existing substrate in...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More