Substrate processing device, method and program

Abstract

This invention provides a base plate treating apparatus. The conveying parts (84A, 84B) of the first and the second base plate hold base plate (G) conveying interval, and the conveying interval refers to the interval from the coating starting position to the coating ending position instead of the total conveying interval from in-position to out-position. The first base plate conveying part (84A) conveys base plate (G [i]) to the coating ending position and returns to the in-position directly, then the base plate conveying part (84A) begins to convey the subsequent new base plate (G [i+1]). While the second base plate conveying parts (84B) conveys the base plate (G [i]) from the coating ending position to the out-position by itself, then the conveying parts (84B) returns to the coating starting position and waits for the arrival of next base plate (G [i+1]) conveyed by the first base plate conveying part (84A) itself. This invention can greatly shorten the intermittent time of supplying treatment fluid to the dealing base plate without rotation mode.

Description

technical field [0001] The present invention relates to the technology of supplying and processing the processing liquid on the substrate to be processed, and particularly relates to the substrate processing technology of coating the processing liquid on the substrate in a non-rotational manner. Background technique [0002] At present, in the photolithography (photolithograph) process in the flat panel display (FPD) manufacturing process, as a resist coating method that is conducive to increasing the size of the substrate (such as a glass substrate) to be processed, it is widely used. The long resist nozzle sprays the resist liquid on the substrate in a strip shape, and the resist liquid is coated on the substrate without rotational movement by scanning the resist nozzle relatively on one side. Rotation-free method for desired film thickness. [0003] According to the conventional resist coating apparatus of the non-rotation method, for example, as described in Patent Docu...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that, in addition to the time required for scanning the resist nozzle (Tc), the time required for carrying or loading the unprocessed substrate on the stage (Tin), The time required for one coating process (Tc+Tin+Tout) obtained from the time required for unloading or carrying out the processed substrate from the stage (Tout) is the tact time (tact time) as it is. , making it difficult to shorten the intermittent time

[0006] Moreover, there is also a problem that it is difficult to keep such a thick and long resist nozzle under load constantly because the size and weight of the long resist nozzle increase with the increase in substrate size. The predetermined height position (narrow gap) above the object stage remains unchanged and it moves stably horizontally at a certain speed

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