Method for producing substrates

Abstract

The invention relates to a method for producing substrates (200) which are produced by successive planar process steps and which comprise a first layer (210) and at least one second layer (220) suited to the first layer (210). In a first step, a plurality of marks (211) is measured on the first layer (210) and a deviation of the actual position from the desired position is determined for every mark (211). These deviations are used to determine a transformation FTrans 1 for the position deviation from any grid point of the first layer (210) and a transformation FTrans 2 for any position deviation from grid points of the second layer (220). The transformation FTrans 2 is determined while taking into account known marginal conditions for a possible warping behavior of the second layer. When the second layer (220) is treated, a combined transformation from the two previously determined transformations FTrans 1 and FTrans 2 is taken into account. The inventive method allows for a reliable contacting of strip conductors despite different degrees of warping of the two layers (210, 220), thereby reducing the portion of refuse of defect circuit boards in the production of multilayer circuit boards.

Description

technical field [0001] The invention relates to a method for producing a multilayer substrate, wherein the multilayer substrate is produced with a first layer and at least one second layer matched to the first layer by successive two-dimensional processing steps. Background technique [0002] During the construction of a multilayer circuit board, the layers of the circuit board are pressed against each other many times. The temperature and compressive stresses applied during this process cause unwanted deformations, such as shrinkage or elongation, in the material used for the circuit board. In different extrusion operations, circuit boards can change their dimensions several times before they are finished. Depending on the layout of the board, ie the structure of the printed conductors realized by the copper surface in a single layer, non-linear deformations can also occur, where elongation or contraction in different directions results in different intensities. [0003] ...

AI Technical Summary

Problems solved by technology

[0009] However, different layers often exhibit different deformation characteristics, or later layers cannot track specific deformations of underlying layers due to technological process aspects

In this case, when using the transformation described by Equation 1, the connection faces of the different printed conductor structures are usually arranged offset from each other, so that the overlap between the connection faces to be bonded is often not large enough to achieve the corresponding connection faces reliable electrical connection

Therefore, boards manufactured in this manner are often defective and must be sorted out of the manufacturing process

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