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8results about How to "Avoid insertion loss" patented technology

Broadband 1-bit reconfigurable circularly polarized reflective array antenna based on multi-resonant structure

ActiveCN119275546Aelectrical size reductionreduce physical sizeAntenna arraysRadiating elements structural formsSoftware engineeringHemt circuits
The invention discloses a broadband 1-bit reconfigurable circularly-polarized reflective array antenna based on a multi-resonant structure. The broadband 1-bit reconfigurable circularly-polarized reflective array antenna comprises a reconfigurable circularly-polarized reflective functional layer, a circularly-polarized horn antenna and an acrylic support. The reconfigurable circular polarization reflection function layer is formed by periodically arranging M * N circular polarization reflection array antenna units with the same structure according to the interval of 0.4125 lambda 0. The circularly polarized reflective array antenna unit is composed of a radiation layer and a direct current bias layer, the radiation layer comprises a circuit pattern designed based on a multi-resonant structure, a PIN diode, a radiation dielectric layer and a reflection bottom plate, and the direct current bias structure comprises a direct current bias dielectric layer and a direct current bias circuit. 1-bit regulation and control of unit reflection phases can be realized by controlling the on-off states of the four PIN diodes, a + / -60-degree beam scanning function can be realized by adjusting the state of each circularly polarized reflective array antenna unit, and the circularly polarized reflective array antenna can be applied to wireless communication and satellite communication systems.
Owner:XIDIAN UNIV

Broadband gain positive slope amplitude-phase control multifunctional chip for T / R assembly

The invention provides a broadband gain positive slope amplitude-phase control multifunctional chip for a T / R assembly, which relates to the technical field of radio frequency integrated circuits and comprises a receiving channel, a transmitting channel, an equalization circuit, a numerical control attenuator, a numerical control phase shifter, a transmitting-receiving change-over switch module and a parallel control module. The parallel control module is used for outputting parallel control signals to the numerical control attenuator, the numerical control phase shifter and the transceiving change-over switch module; the equalization circuit is respectively connected with the receiving channel and the transmitting channel through the transmitting-receiving change-over switch module, so that a signal path of the receiving channel and a signal path of the transmitting channel multiplex the equalization circuit, the numerical control attenuator and the numerical control phase shifter; and the equalization circuit is of an on-chip integrated structure and is used for adjusting the gain of the receiving channel and the gain of the transmitting channel to present a positive slope characteristic relative to the frequency in a wide frequency band so as to compensate the frequency attenuation of an external device.
Owner:SICHUAN YIFENG ELECTRONICS SCI & TECH CO LTD

PCB manufacturing method capable of increasing bonding force of bonding pad and PCB

The invention provides a PCB manufacturing method capable of increasing bonding force of a bonding pad and a PCB. The manufacturing method of the PCB capable of increasing the bonding force of the bonding pad comprises the following steps: manufacturing an inner-layer circuit on an inner-layer core board; performing lamination operation on the plurality of inner core boards, the plurality of copper foil layers and the plurality of bonding layers to form a multi-layer board; performing outer-layer circuit manufacturing on the multi-layer board; performing drilling operation on a bonding pad of the multilayer board to form a reinforcing blind hole extending into the first dielectric layer; and metalized hole filling operation is carried out on the reinforcing blind hole so as to fill and level up the reinforcing blind hole. When the insertion loss is reduced by reducing the roughness of the copper foil, as the bonding pad is fixedly connected to the first dielectric layer through the metalized copper structure, the bonding force of the bonding pad is improved, the problem of insufficient bonding force of the bonding pad is avoided, the problem of bonding pad separation is inhibited, and the insertion loss is reduced on the premise that the bonding force of the bonding pad is not reduced.
Owner:CAMELOT QINGYUAN HYTEC TECH INVESTMENT

Wireless communication device and equipment

The invention provides a wireless communication device and equipment. The wireless communication device comprises at least one first antenna, at least two second antennas, a radio frequency front end module and an access switching module, the at least one first antenna is connected with the radio frequency front-end module, and the at least two second antennas are connected with the radio frequency front-end module through the access switching module; wherein the at least one first antenna at least serves as a transmitting antenna and is used for transmitting a first transmitting signal output by the radio frequency front-end module; the at least two second antennas serve as receiving antennas and are used for receiving receiving signals; the path switching module is used for conducting a path between any one of the at least two second antennas and the radio frequency front-end module so as to transmit a received signal to the radio frequency front-end module, and the radio frequency front-end module is used for filtering and / or amplifying the received signal.
Owner:GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD

LVDS connector device

The utility model provides an LVDS connector device, which comprises a first connector, the first connector comprises a metal shell, the metal shell comprises a first upper shell and a first lower shell which are embedded with each other, the width directions of the first upper shell and the first lower shell are provided with inserting parts, a cavity is formed between the inserting parts, and the first upper shell and the first lower shell are provided with a plurality of through holes. Two groups of openings are oppositely formed in the accommodating cavity in the length directions of the first upper shell and the first lower shell, a first plastic main body is arranged in the accommodating cavity, and a plug-in tongue of the first plastic main body extends out of the opening in one side of the plug-in part; according to the connector, the positioning points and the positioning grooves are arranged on the first lower shell and the second lower shell, so that the matching of the connector is more stable, the plugging hand feeling is better, and the service life is prolonged; the first connector is provided with the pre-guiding surface, so that the connector can have a pre-guiding effect when being plugged, and the connector is prevented from being plugged and damaged.
Owner:昆山友茂电子有限公司

A cross-band coupling interference suppression structure, suppression system and suppression method

PendingCN122512147AMaintain electromagnetic transparencyImprove Radiation Performance
The application provides a cross-band coupling interference suppression structure, a suppression system and a suppression method. In the cross-band coupling interference suppression structure, a low-frequency antenna is fixed at a first height position above a frequency selective surface and used for transmitting a low-frequency signal; a high-frequency antenna unit is fixed at a second height position below the frequency selective surface and used for transmitting a high-frequency signal; the frequency selective surface is used for reflecting the low-frequency signal and transmitting the high-frequency signal; and a reflection layer is arranged below the low-frequency antenna unit and used for reflecting the high-frequency signal. The application sets the frequency selective surface capable of transmitting the high-frequency signal and reflecting the low-frequency signal in the cross-band structure, enhances the radiation performance of the low-frequency signal of the low-frequency band antenna by reflecting the low-frequency signal, keeps the high-frequency band antenna electromagnetically transparent, avoids introducing additional insertion loss, reduces the cross-band coupling interference, and improves the working stability of the interference suppression structure.
Owner:SHENZHEN UNIV

Non-switching composite dual-mode large dynamic reconfigurable power amplifier and electronic equipment

PendingCN119254161AAvoid insertion lossavoid parasitic effectsPower amplifiersAmplifiers wit coupling networksAudio power amplifierGate voltage
The invention relates to a non-switching composite dual-mode large dynamic reconfigurable power amplifier and electronic equipment. The amplifier comprises an input end dual-mode reconfigurable switching unit, an output end dual-mode reconfigurable switching unit, a high-power amplifier and a low-power amplifier, wherein the target states of the input end dual-mode reconfigurable switching unit and the output end dual-mode reconfigurable switching unit are equivalently simulated by controlling the grid voltage and the drain voltage of the high-power amplifier and the low-power amplifier, the power of the radio frequency input is amplified to obtain the radio frequency output, and the target states comprise the opening state and the closing state. Under the condition that a switch structure is not adopted, composite dual-mode reconfiguration of frequency reconfiguration and power reconfiguration is achieved, and insertion loss and parasitic effect caused by introduction of a switch in the prior art are avoided.
Owner:NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD

Antenna and electronic equipment

The invention discloses an antenna and electronic equipment, and the antenna comprises a first antenna array, a second antenna array, a single board, a radiator, and a first radio frequency connector, and the first antenna array and the second antenna array are used for transmitting and / or receiving signals. The single board is provided with one or more components for processing signals; the radiator is used for radiating the assembly; the first radio frequency connector is used for the signal connection assembly and the first antenna array; the second antenna array, the single board, the radiator and the first antenna array are stacked in the first direction; the radiator is located between the single board and the first antenna array, and the single board is located between the second antenna array and the radiator; the radiator comprises a plurality of radiating tooth sheets which are arranged in a stacked mode in the second direction or the third direction, a gap is formed between at least two adjacent radiating tooth sheets, the first radio frequency connector is contained in the gap, and the first direction, the second direction and the third direction are perpendicular to one another. According to the antenna and the electronic equipment provided by the embodiment of the invention, the networking investment cost can be reduced.
Owner:SHANGHAI HUAWEI TECH CO LTD