The
laser chip fabrication method and
laser chip disclosed herein include a light-emitting region and an electro-absorption modulation region. The P-InP layer includes a first region, a second region, and a third region, with a second active region located below the third region. The first and second regions are exposed to the implanted
ion beam, forming a first and a second electrically isolated region. The third region, protected by a
mask, remains conductive, forming a first P-InP body layer. During
ion implantation, the first and second
metal layers act as masks for the first P-InP body layer, intercepting
ion implantation and preventing ions from penetrating deep into the first P-InP body layer, thus maintaining its
conductivity. The narrow linewidths of the first and second
metal layers reduce the
ion implantation width of the first P-InP body layer, resulting in a narrower linewidth first P-InP body layer, which is beneficial for improving the modulation rate and
modulation bandwidth of the electro-absorption modulation region.