The invention relates to a signal emission control method and device based on optical communication and a signal emission laser. The method comprises the following steps: acquiring output light intensity data of the vertical cavity surface emitting laser in a preset temperature range and a bias current range, and determining a bistable working characteristic curve; acquiring a vibration resonancegainsignal; gaussian distribution transformation and target phase sampling are performed on the vibration resonancegain signal, and a signal nonlinear compensation model is established; applying a driving current pulse synchronous with communication data, symmetrically sampling the output signal subjected to transient response control at a rising edge and a falling edge, and constructing a signal quality evaluation vector; and inputting a support vector regression model, establishing a mapping relation between the light intensity characteristic parameter and the driving control parameter, and generating a real-time control signal of the laser. According to the invention, the self-adaptive accurate control of the vertical cavity surface emitting laser is realized, and the stable operation of the signal emitting laser under the temperature and bias current fluctuation condition is ensured.
The present invention provides a light intensity modulation method based on a Sagnac interference structure, which relates to the technical field of quantum information and optical fiber communication. The method comprises: determining a predetermined distance between a phase modulator and a center position of a Sagnac modulation ring according to a target modulation condition, so that a reverse pulse of the th period and a positive pulse of the th period enter the phase modulator at the same time, and a reverse pulse of the th period and a positive pulse of the th period enter the phase modulator at the same time; determining waveform parameters of an electrical signal according to a predetermined modulation rate and a predetermined modulation period; determining parameters of a phase modulator according to a predetermined modulation rate threshold; determining a first duration according to a target modulation form; and realizing light intensity modulation of a light pulse by a Sagnac interference structure according to the waveform parameters of the electrical signal, the parameters of the phase modulator and the first duration.
The invention provides a directly modulated laser, which comprises a substrate, an epitaxial layer, a buffer layer, a grating layer, a lower limiting layer, an active layer, an upper limiting layer, a corrosioncut-off layer, a cladding and a contact layer, the structure of the grating layer is a convex grating structure with a lambda / 8 phase shift, the grating layer is located on the N-type doped side, and the convex grating structure with the lambda / 8 phase shift is used for reducing the photon density at the phase shift position through the negative reflector loss feedback effect and limiting hole gathering on the P-type doped side through the characteristic that the electron mobility is larger than the hole mobility.
The invention discloses a silicon optical device structure and an implementation method. The silicon optical device structure comprises a dielectric layer and a semiconductor layer which are sequentially arranged on a substrate, the semiconductor layer is provided with an active area, the semiconductor layer in the active area forms a semiconductor pattern, the surface of the semiconductor pattern is provided with a light source window penetrating to the surface of the dielectric layer, and a quantum dot light source is arranged in the light source window. According to the invention, the preparation process of the quantum dot light source is integrated into the shallow trench isolation process in the silicon light process flow, so that a new mode of integrating the silicon light device of the silicon quantum dot light source by using the silicon light process is realized.
The laserchip fabrication method and laserchip disclosed herein include a light-emitting region and an electro-absorption modulation region. The P-InP layer includes a first region, a second region, and a third region, with a second active region located below the third region. The first and second regions are exposed to the implanted ion beam, forming a first and a second electrically isolated region. The third region, protected by a mask, remains conductive, forming a first P-InP body layer. During ion implantation, the first and second metallayers act as masks for the first P-InP body layer, intercepting ion implantation and preventing ions from penetrating deep into the first P-InP body layer, thus maintaining its conductivity. The narrow linewidths of the first and second metallayers reduce the ion implantation width of the first P-InP body layer, resulting in a narrower linewidth first P-InP body layer, which is beneficial for improving the modulation rate and modulation bandwidth of the electro-absorption modulation region.