Sensor and sensor system for optically detecting objects, insertion head, method for determining the height position of a component
An optical detection and sensor technology, applied in the field of optical detection, can solve the problems of difficult calibration of measurement devices, expensive measurement devices, etc., and achieve the effect of simple calibration and cheap manufacturing
Active Publication Date: 2012-01-11
SIEMENS ELECTRONICS ASSEMBLY SYST LLC
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- Application Information
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Problems solved by technology
The optical measuring device has the disadvantage that a plurality of optical components are required for each optical projection system, making the measuring device overall more expensive
Another disadvantage is that the measuring device can only be calibrated with difficulty
Method used
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[0033] figure 1 The sensor 100 shown in FIG. 1 is used to detect the position of a component 180 that is picked up by a holding device 165 of an assembly head not shown. The sensor includes an optical module 120 and an electronic module 130, and different optical components or electronic components of the sensor 100 are respectively allocated to them. The electronic module 130 includes a function generator 131 as a clock generating unit, and the function generator 131 is electronically coupled to the light emitting diode 115 such that the light emitting diode 115 emits light in a periodic modulation manner according to the output signal of the function generator 131 . The light emitting diode 115 may be arranged inside the electronic module 130 or may also be arranged outside the electronic module 130.
[0034] The light emitting diode 115 is optically coupled with the optical waveguide 100, wherein the light emitted by the light emitting diode 115 is coupled into the fiber core...
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Abstract
This invention is a sensor for optical detection. The sensor is comprised of point-like light-emitting component (322) for emitting measure light, optical receiving element (328) and analysis unit for receiving measure light plane. The analysis unit (180) is arranged between the light-emitting component and the optical receiving element and can examine by photic blind. Further more, this sensor system of the invention can bear two sensors by allotting their analysis units to a same electronic module. This invention can also used to take up, convey and mount assembly head (350) of setting element (380), and the assembly head is comprised of base body (360), element holding unit (362) and this invention sensor. This invention also illuminates method for setting the height for picking up element from the holding unit, wherein the sensor, the sensor system or the assembly head are used.
Description
Technical field [0001] The present invention relates to a sensor and a sensor system for optical detection of objects, in particular for the presence control and / or position determination of electronic components, wherein the electronic components are assembled separately for the purpose of assembly on a component carrier Pick up the holding device of the head (Bes tueckkopf). In addition, the present invention relates to an assembly head for picking up components, transferring components, and placing components on a component carrier to be assembled. Furthermore, the present invention relates to a method for determining the height position of a component picked up by a holding device using the above-mentioned sensor, the above-mentioned sensor system, or the above-mentioned assembly head. Background technique [0002] In the case of automatic assembly of the component carrier by an automatic assembly machine, an assembly head with one or more holding devices takes out the compo...
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IPC IPC(8): H05K13/08H05K13/04G01N21/84G06K9/20
CPCH05K13/0413G01B11/2433G01B11/0608H05K13/0812
Inventor S·伯格
Owner SIEMENS ELECTRONICS ASSEMBLY SYST LLC