Submount for light emitting/receiving device

一种光收发、用子座的技术，应用在电气元件、激光器零部件、半导体激光器的结构细节等方向，能够解决发光元件102散热性能不良、子座价格高、热传导性能差等问题，达到良好光传输性能的效果
CN1883056AInactive Publication Date: 2006-12-20SHARP KK
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHARP KK
Publication Date
2006-12-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

In a submount main body (1) composed of a single crystal silicon, a mounting surface (4) on which a light-emitting device (11) is mounted is composed of a (100)-oriented surface and the inner surface of a through hole (3) which is formed by anisotropic etching is parallel to the (110)-oriented surface. The light-emitting portion of the light-emitting device (11) is arranged to face a device-side opening (31) which opens into the mounting surface (4) of the submount main body (1). Consequently, heat generated in the light-emitting device (11) can be discharged to the outside more efficiently than the case where the light-emitting portion is arranged to face a side opposite to the submount side. Specifically, light from the light-emitting device (11) is reflected by a reflective surface formed on the surface of the through hole (3), and highly efficiently transmitted outside of the submount main body (1).
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Description

technical field

[0001] The present invention relates to a submount for optical transceiver elements that are used in optical communications and automobiles and require reduced power consumption and heat dissipation. Background technique

[0002] In recent years, especially with the increase in luminance of LEDs (Light Emitting Diodes), high heat dissipation performance has been demanded for submounts on which the LEDs are mounted. Submounts with high heat dissipation performance include, for example, those using diamonds used in the above-mentioned optical communication system for long-distance transmission. The above-mentioned optical communication system for long-distance transmission is relatively expensive, so expensive components such as the above-mentioned diamond can be used.

[0003] However, in lighting and vehicle equipment using a large number of high-intensity LEDs, and in optical communication systems for short-distance transmission with relatively low setup co...

Claims

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