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7results about How to "Efficient reflection" patented technology

Electromagnetic wave wideband frequency shift preserving transmission method based on double constitutive parameter time-varying circuit

ActiveCN122026818BNo reflectionReflective, reflective and efficientMulti-frequency-changing modulation transferenceSoftware engineeringRadio frequency
This invention discloses a broadband frequency-shifting conformal transmission method for electromagnetic waves based on a time-varying circuit with dual constitutive parameters, belonging to the fields of microwave radio frequency, time metamaterials, and frequency domain transformation technology. The method is implemented using a frequency-shifting transmission circuit, which includes a microstrip transmission line and a periodically loaded inductor branch. The inductor branch includes switches, series inductors, and parallel inductors. When all switches in the frequency-shifting transmission circuit are open, an input pulse signal is sent to the circuit. When the pulse signal has fully entered the microstrip transmission line, all switches close simultaneously. Due to the wavenumber conservation of the microstrip transmission line, frequency shift occurs, achieving frequency-shifting transmission. This method does not rely on a complex local oscillator system, does not increase circuit complexity excessively, and theoretically does not generate harmonics. It achieves broadband frequency shifting, reflection-free, high-efficiency transmission, and waveform distortion-free conformal transmission, providing a new technical path for broadband, low-distortion signal processing in the microwave radio frequency field.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Double-beam synchronous following anti-reflection device for laser forging printing

The invention discloses a double-beam synchronous following anti-reflection device for laser forging printing, which is characterized in that the specific wavelength combination of 1064nm powder bed cladding laser and 532nm green ultrafast strengthening laser is adopted to impact a fusion layer, and a special reflecting coating with the wavelength of 532nm is coated on a scanning galvanometer mechanism; therefore, the coating can selectively transmit laser of 1064nm and efficiently reflect laser of 532nm at the same time by utilizing the obvious wavelength difference between the two; on the basis, diffuse reflection of green ultrafast laser can be selectively isolated, so that damage to the laser caused by return light is fundamentally avoided, stable work of equipment in a long-time and high-power following mode is ensured, and therefore, the device is very suitable for large-scale application and popularization in the technical field of laser forging printing.
Owner:AIR FORCE UNIV PLA

Radiant cooling composite yarn and method of making same

PendingCN122279823AEfficient reflectionRealize passive coolingTextile fiberYarn
This invention belongs to the field of textile fiber technology and discloses a radiation-cooling composite yarn and its preparation method. The radiation-cooling composite yarn includes an elastic core, an intermediate covering layer, and an outer layer; the intermediate covering layer covers the outside of the elastic core; the outer layer covers the outside of the intermediate covering layer and includes a radiation-cooling nanofiber membrane. This invention provides a radiation-cooling composite yarn comprising an elastic core, an intermediate covering layer, and an outer layer arranged in three layers; the outermost radiation-cooling nanofiber membrane can efficiently reflect sunlight and radiate heat outward through atmospheric windows, achieving passive cooling of the fabric; simultaneously, when the human body temperature is lower than the outdoor temperature, the fabric has a certain degree of heat retention due to the presence of still air inside the elastic core of the yarn; based on the yarn composition, the movement of the human body can be tracked by utilizing the law of yarn elongation change and its resistance change.
Owner:HUBEI XIANCHUANG TECH CO LTD

Super-reflective photovoltaic synergistic coating, preparation method and application thereof

PendingCN122326052AEfficient reflectionlow costAcrylic resinPhysical chemistry
This invention belongs to the field of coating technology, specifically relating to a super-reflective photovoltaic enhancement coating, its preparation method, and its application. The coating raw materials include water-based acrylic resin, filler, titanium dioxide, dispersant, defoamer, and leveling agent; wherein the filler includes barium sulfate and / or core-shell particles, and the barium sulfate includes at least one of nano-sized barium sulfate, submicron-sized barium sulfate, micron-sized barium sulfate, and modified barium sulfate. The preparation method involves: adding the filler to deionized water, adding the dispersant, and dispersing; adding the water-based acrylic resin and stirring; adding titanium dioxide, defoamer, and leveling agent to adjust the fineness; adjusting the viscosity; and filtering to obtain the super-reflective photovoltaic enhancement coating. The coating is applied to photovoltaic modules. This invention's coating has the advantages of high reflectivity, full-band coverage, low cost, and stable performance.
Owner:SHANGHAI KAISHAN ZHONGXIA ENERGY SAVING & ENVIRONMENTAL PROTECTION TECH CO LTD +1

Array type circular truncated cone type optical fiber probe underground multiphase flow gas holdup sensor

The invention relates to the technical field of optical fiber sensing, and discloses an array type circular truncated cone type optical fiber probe underground multiphase flow gas holdup sensor which comprises an array type optical fiber probe formed by a plurality of optical fiber probes, and the array type optical fiber probe is distributed in an underground measuring pipeline in a cross symmetry mode along the cross section of the pipeline; wherein each optical fiber probe is formed by grinding the tip part of the single-mode optical fiber, so that the tip part is of a circular truncated cone-shaped structure. Compared with an existing optical fiber sensor, the array type circular-truncated-cone-shaped optical fiber probe underground multiphase flow gas holdup sensor is higher in gas holdup measurement precision and lower in cost.
Owner:NORTHWEST UNIV

High-precision parallel plate capacitive sensor structure

The utility model discloses a high-precision parallel-plate capacitive sensor structure, which belongs to the field of parallel-plate capacitive sensors and comprises a bottom plate, a sensor assembly is arranged on the bottom plate and consists of an upper polar plate and a lower polar plate, the upper polar plate and the lower polar plate are fixedly mounted on two insulating support columns respectively, and a distance adjusting mechanism is mounted on the bottom plate. The bottom plate is further provided with a shielding mechanism, the shielding mechanism comprises a permalloy shielding cover, a copper net is fixed in the permalloy shielding cover, a rectangular groove is formed in the top of the bottom plate, and the permalloy shielding cover and the copper net are installed in the rectangular groove in an embedded mode. According to the utility model, through the arrangement of the shielding mechanism, the effect of efficiently shielding various electromagnetic interferences is achieved, a double-layer structure formed by the permalloy shielding cover and the internal copper net can shield a low-frequency magnetic field and high-frequency electromagnetic radiation respectively, and permalloy has a good magnetic conduction shielding effect on the low-frequency magnetic field.
Owner:JIANGSU ZHONGHUO SENSOR TECH CO LTD

Flip chip LED packaging structure based on 2835 support and implementation method thereof

PendingCN121888772AEliminate occlusionEliminate absorbencyElectrical connectionSolder paste
The invention discloses a 2835 support-based flip chip LED packaging structure, which comprises a support body and an LED flip chip, a cavity is arranged in the support body, the bottom of the cavity is connected with a centrally arranged metal electrode, the LED flip chip is arranged in the cavity, the LED flip chip is connected with the metal electrode, a white glue layer is filled between the LED flip chip and the cavity, and the bottom of the cavity is connected with the metal electrode. A packaging layer is arranged above the white glue layer in the cavity; the invention further discloses an implementation method of the flip chip LED packaging structure based on the 2835 support. The LED flip chip is directly connected to the metal electrode through the eutectic bonding or solder paste sintering process, the PN electrode of the LED flip chip makes contact with the positive electrode and the negative electrode of the support body, no gold wire is needed for electrical connection, and therefore shielding and absorption of the gold wire to emergent light are thoroughly eliminated, and the light extraction efficiency is improved.
Owner:HENGDIAN GRP TOSPO LIGHTING