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Tape for tape carrier package

A load-carrying and packaging structure technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of broken pins 21 and poor flexibility, so as to reduce stress, improve flexibility, The effect of reducing the stress concentration factor

Inactive Publication Date: 2006-12-27
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, if figure 2 As shown, the corner (comer) 23 of the element hole 22 of the tape 20 is a chamfer (Fillet) shape, which is easy to form stress concentration, so that the pin 21 is broken during the packaging process due to the influence of pressure and high temperature.
In addition, the web 20 is also less flexible due to this shape.

Method used

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  • Tape for tape carrier package
  • Tape for tape carrier package
  • Tape for tape carrier package

Examples

Experimental program
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Effect test

Embodiment Construction

[0021] The invention provides a reel for tape carrier packaging. A tape according to a preferred embodiment of the present invention includes a flexible insulating film. The flexible insulating film is divided into a plurality of consecutive units, and each unit has a component hole and a plurality of pins. The element hole has a plurality of corners formed in the form of notches. The pins are formed on a flexible insulating film and extend to the element holes.

[0022] see image 3 , image 3 It is a schematic diagram of the tape carrier package structure of the first preferred embodiment of the present invention. Such as image 3 As shown, the tape carrier package structure 3 includes a reel 30 and a semiconductor chip 10 .

[0023] The tape 30 is divided into a plurality of consecutive units, and each unit includes a flexible insulating film 32 and a plurality of pins 34 . The thickness of the flexible insulating film 32 is about tens of microns and has flexibility,...

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PUM

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Abstract

The disclosed ribbon for belt-loading package comprises a flexible insulation film divided into multiple continual elements every with one member hole and some pins, wherein forming the pin on the film to extend to the hole with some gap corners. This invention can reduce stress led by temperature change, increases product flexibility, and improves package reliability.

Description

technical field [0001] The present invention relates to a circuit tape for packaging, in particular to a tape suitable for tape carrier package (TCP). Background technique [0002] Tape carrier packaging is one of the common integrated circuit packaging methods at present. Tape carrier packaging uses a flexible tape with component holes and multiple pins as a chip carrier, and is usually used in the packaging of semiconductor components that drive liquid crystal displays. [0003] see figure 1 and figure 2 , figure 1 is a cross-sectional view of an existing load-carrying package structure, figure 2 This is a schematic top view of the existing tape-carrying package structure. Such as figure 1 As shown, the existing tape package structure 2 includes a semiconductor die 10 , a tape 20 and an encapsulant 14 . The semiconductor chip 10 has a plurality of bumps (Bumps) 12 . The tape 20 has a plurality of leads (Leads) 21 and element holes 22 . The pins 21 extend to the c...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/60H01L23/12H01L23/50H01L23/28
CPCH01L2224/50
Inventor 沈弘哲刘宏信沈更新
Owner CHIPMOS TECH INC
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