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Positive-working photosensitive composition

A photosensitive composition and positive-type technology, applied in optics, optomechanical equipment, and photosensitive materials used in optomechanical equipment, etc., can solve problems such as longer device routes, uneven control of rollers, and retreat of pattern outlines, etc., to achieve The alkali concentration is easily lowered, the carbon dioxide gas dissolves less, and the effect of reducing the pH over time is small

Inactive Publication Date: 2007-01-31
THINK LABORATORY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat treatment and subsequent cooling consume energy and time, and also lengthen the device route, which increases equipment costs and operating costs, etc.
[0058] In addition, when performing heat treatment, since the drum is different from the thin plate material, the heat load is large. It takes 30 to 60 minutes to heat up to the required temperature, and it takes more than 50 to 100 minutes to cool down to room temperature. These times vary depending on the size of the drum. not uniformly controlled
In addition, heat treatment will modify the anthocyanin pigment, reduce the sensitivity, and deteriorate the definition of the edge of the pattern. At the same time, the resist will become thinner during development, and the outline of the pattern will recede, which will become a cause of pinholes.

Method used

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  • Positive-working photosensitive composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0304] As shown in Table 1, predetermined amounts of various compounding substances were compounded to prepare compositions. After heating the obtained composition at 40 degreeC and stabilizing a positive photosensitive composition, it was used as the photosensitive liquid for a test.

[0305] Compounding substances

Dosage

(parts by weight)

ingredient (A)

Resin A1

100

ingredient (B)

Amine compound 1

0.3

ingredient (C)

Infrared Absorbing Pigment C1

3

ingredient (D)

Repellent 1

2

ingredient (E)

Photoacid generator 1

2

Component (F)

Resin F1

8

ingredient (G)

Chromochrome G1

2

solvent

PM

IPA

MEK

590

737

589

[0306] The components in Table 1 are as follows.

[0307] Resin 1: SMA 1440 (produced by SARTOMER, a partial esterification product of styrene / maleic anhydride copolymer formed by butyl ce...

Embodiment 2～6

[0344] Except having changed the components (C) and (G) in the composition as shown in Table 4, it experimented similarly to Example 1-2. Wherein the measurement condition is carried out under 45% humidity. The results are recorded in Table 4 together.

[0345] ingredient (C)

Dosage

ingredient (G)

Dosage

Adhere

sex

Sensitivity

(mJ / cm 2 )

development

(Second)

Residual film rate

(%)

image

marginal

clarity

Developing width

Capacity

Example

2

Pigment C2

1

Pigment G2

6

◎

220

75

73

◎

◎

◎

Example

3

Pigment C3

3

Pigment G3

3

◎

220

75

75

◎

◎

◎

Example

4

Pigment C4

4

Pigment G4

4

◎

220

75

73

◎

◎

◎

...

Embodiment 7～16

[0358] Except having changed the component (A) in a composition as shown in Table 5, it experimented similarly to Example 1-2. The results are recorded in Table 5 together.

[0359] ingredient (A)

Adhesion

Sensitivity

(mJ / cm 2 )

development

(Second)

Residual film rate

(%)

image

Edge of Qing

Clarity

develop tolerance

Spend

Example 7

Resin A2

◎

220

75

76

◎

◎

◎

Example 8

Resin A3

◎

220

75

77

◎

◎

◎

Example 9

Resin A4

◎

220

75

75

◎

◎

◎

Example 10

Resin A5

◎

220

75

73

◎

◎

◎

Example 11

Resin A6

◎

220

75

72

◎

◎

◎

Example 12

Resin A7

◎

220

75

75

◎

◎

◎

Example 13

Resin A8

◎

220 ...

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Abstract

There is provided a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 25 to 60%, is excellent in stability on standing and reproducibility, can be developed at a low alkali intensity, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film and is improved in scratch resistance in the handling before development. The positive photosensitive composition comprises, as essential components, (A) a high molecular substance having at least one carboxyl group and / or at least one acid anhydride group in a molecule thereof, (B) an amine compound, and (C) a photo-thermal conversion material that absorbs infrared rays from an image exposure light source to convert the rays to heat.

Description

technical field [0001] The present invention relates to a positive-type photosensitive composition, and more specifically relates to an alkali-soluble positive-type photosensitive composition having sensitivity in the infrared wavelength region and requiring no heat treatment after coating. The sensitivity in the infrared wavelength region refers to Under the exposure of laser light with a wavelength of 700-1,100nm, the sensitive part becomes soluble in the alkali developer solution, and the positive photosensitive composition of the present invention can be effectively used in photolithography (ie, photochemical etching manufacturing method). Among them, it is especially suitable for the optical engraving field of manufacturing printing plates, electronic components, precision instrument components, and related components for anti-counterfeiting. Background technique [0002] The existing positive-type photosensitive lithographic printing plate in the past is known to conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/00G03F7/004
CPCB41M5/368B41C1/1008B41C2210/02B41C2210/06B41C2210/22B41C2210/24G03F7/0045G03F7/0392
Inventor 佐藤勉戈正平
Owner THINK LABORATORY CO LTD
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