Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of printed circuit board

A technology for printed circuit boards and manufacturing methods, applied in the direction of printed circuit manufacturing, multilayer circuit manufacturing, printed circuits, etc., to achieve the effects of ensuring integrity, reducing interlayer misalignment, and avoiding the addition of blocking blocks

Active Publication Date: 2007-02-14
HUAWEI TECH CO LTD
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of adhesive overflow when the prepreg with a higher glue content is selected as the interlayer medium for interlayer lamination, and to provide a method that can avoid or reduce adhesive overflow and PCB manufacturing method where misalignment occurs between layers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board
  • Manufacturing method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] image 3 It is a schematic diagram of the stacking of six-layer boards combined with a single prepreg in Example 1 of the present invention and then locked. Figure 4 It is a flowchart of the method described in embodiment 1, comprising the steps of:

[0045] First, select and cut the core board 4 and the prepreg 3, so that the prepreg 3 is longer than the core board 4 in both length and width directions, so as to form a spare area A on the edge profile of the prepreg 3, preferably 0.5 to 1.0 inches longer on each side , the profile of the surface layer copper foil 6 is substantially the same as that of the prepreg 3;

[0046] Secondly, the prepreg 3 and a plurality of core boards 4 are alternately laminated according to the design sequence to form a laminate, wherein the upper and lower surfaces of the laminate are the prepreg 3;

[0047] After lamination, use connectors 5 such as rivets or staples to evenly lock the edges of all the prepregs 3 of the laminate 7 in t...

Embodiment 2

[0056] Generally, when the thickness of the interlayer prepreg is 14 mils to 16 mils (mil, 1 mil=25.4×10-6m), it is necessary to connect two or more prepregs into one. An example in which two sheets of prepreg are connected as one, of course, there may be multiple sheets.

[0057] Figure 5 It is a schematic diagram of Embodiment 2 of the present invention, and two pre-locked prepregs 3 are used for lamination between six-layer boards, that is, two layers of prepregs are first connected and then laminated. Such as Figure 5 As shown, when a plurality of prepregs 3 with higher glue content are used to assemble a printed circuit board, it is basically the same as that in Example 1. Image 6 It is the flowchart of the method described in embodiment 2, comprising the steps:

[0058] First, select and cut the core board 4 and the prepreg 3, so that the prepreg 3 is longer than the core board 4 in both length and width directions, so as to form a spare area A on the edge profile ...

Embodiment 3

[0067] Figure 7 It is a schematic diagram of Embodiment 3 of the present invention, and two pre-locked prepregs 3 are directly laminated and pressed between the six-layer boards. Such as Figure 7 As shown, when a plurality of prepregs with higher glue content are used to combine printed circuit boards, it is basically the same as in Examples 1 and 2, Figure 8 It is the flowchart of the method described in embodiment 3, comprising the steps:

[0068] First, select and cut the core board 4 and the prepreg 3, so that the prepreg 3 is longer than the core board 4 in both length and width directions, so as to form a spare area A on the edge profile of the prepreg 3, preferably 0.5 to 1.0 inches longer on each side , the profile of the surface layer copper foil 6 is substantially the same as that of the prepreg 3;

[0069] Secondly, first use connecting parts 81 such as rivets or staples to evenly lock the edges of the two prepregs 3 in the spare area A to form a prepreg body;...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing PCB, which shows as follow: during the preparing stage for manufacturing the circuit board, there is a surplus region on the semi-solid slices comparing to the core bands in the length and width direction, during the manufacturing stage for the inner pattern, laying the semi-solid slices and the core bands alternately into a layering body, then fixing all the semi-solid slices of the layering body at the surplus region with rivets or staples to make it into an entire body, then laying a copper foil on the top and bottom surface of the entire body, then compressing it, finally, cutting the surplus region with the connecting-pieces off.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a method for manufacturing a printed circuit board. Background technique [0002] Such as Figure 1 to Figure 2 As shown, the well-known multilayer PCB (Print Circuit Board, printed circuit board) is generally formed by arranging copper foil 2 on both sides of the medium 1. The formed prepreg 3 is formed, or the core board 4 is stacked with the prepreg 3 and the surface copper foil 6 is formed, that is figure 1 core board 4 and figure 2 The prepregs 3 are stacked alternately. image 3 It is a superimposed schematic diagram of a six-layer board formed by superimposing the core board 4 and the prepreg 3 plus the surface layer copper foil 6, through image 3 We can have a clearer understanding of printed circuit boards. [0003] Generally speaking, the process flow of multi-layer PCB production roughly includes the preparatory work stage, the inner layer graphics produ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/00
Inventor 刘启晌唐晟何波袁振华程诗平
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com