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Screen printing apparatus and screen printing method

A screen printing device and screen printing technology, applied in the direction of screen printing machine, printing device, printing, etc., can solve the problems of removal failure, inconsistent removal operation mode, difficulty in ensuring removability, etc. The effect of stable print quality and good removability

Inactive Publication Date: 2007-02-28
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, even in the case where the removal operation mode is optimized in advance according to the properties of the solder, failure in the removal process may occur because if deterioration over time causes a change in properties such as an increase in viscosity , removing the mode of operation does not coincide with the optimal mode
As described above, in screen printing according to the background art, there arises a problem that it is difficult to ensure good removability when using solder that tends to change over time

Method used

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  • Screen printing apparatus and screen printing method
  • Screen printing apparatus and screen printing method
  • Screen printing apparatus and screen printing method

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Embodiment Construction

[0014] Embodiments of the present invention will be described with reference to the drawings. 1 and 2, the structure of the screen printing apparatus will be described. The screen printing device has a function of bringing the board into contact with the lower surface of the mask plate in which the through hole is formed and printing cream solder on the board through the through hole. In FIG. 1 , a plate positioning unit 1 is configured such that a Y-axis stage 2 , an X-axis stage 3 , a θ-axis stage 4 , and a Z-axis stage 5 are stacked. A board supporting part 6 for supporting and fixing a board 7 as a printing body is provided on the Z-axis stage 5 . The panel 7 on the panel supporting portion 6 is clamped by the clamper 8 .

[0015] As shown in FIG. 2 , the θ-axis stage 4 has a rotating plate 4 a that rotates by an angle θ around the vertical axis based on the shaft portion 16 . When the θ-axis motor 15 drives the shaft portion 16 to rotate through the conveyor belt 17, t...

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Abstract

In screen printing for printing cream-like solder on a board 7 through through-holes of a mask plate 12, removal of the board 7 from a lower surface of the mask plate 12 is performed in such a manner that the board 7 is moved down at a first descending velocity V1 as a lower velocity during an initial stroke S1 of from a state where the removal of the board 7 starts to a state where the board 7 is removed from the mask plate 12 so that the distance between the upper surface of the board 7 and the lower surface of the mask plate 12 reaches a predetermined value set to be in a range of from a half to twice as large as the thickness of the mask plate 12, and that the board 7 is moved down at a second descending velocity V2 as a higher velocity after the initial stroke S1. Accordingly, even in the case where solder apt to vary according to the passage of time is used, good removability and stable print quality can be secured.

Description

technical field [0001] The invention relates to a screen printing device and a screen printing method for printing paste solder on a board. Background technique [0002] A method using screen printing is known as a solder supply method for soldering electronic parts to boards. In this method, a screen printing device is used, which has a screen printing mechanism in which cream solder is printed on the electrode surface of the board through pattern holes provided in the mask, and in which the board is brought into contact with In the case of the lower surface of the reticle, the squeegee slides on the upper surface of the reticle (for example, see Patent Document JP-A-8-11283 / (1996)). [0003] In order to maintain good printing quality of screen printing, it is required to reliably fill the pattern hole with good filling performance of cream solder, and to remove the mask from the lower surface of the board after filling the cream solder without damaging the shape from the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/34B41F15/40B41F15/08B41M1/12H01L21/48
CPCB41M1/12H05K2203/0264H01L21/4867H05K3/1233
Inventor 大武裕治坂上隆昭田中哲矢
Owner PANASONIC CORP