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Removable thermal-conductive phase change material and preparation method thereof

A phase change material and removal technology, applied in the field of polymer materials, can solve the problems of difficult electronic component repair, electronic component damage, electronic component damage, etc., to achieve good thermal conductivity and removability, easy peeling, phase Good heat transfer effect

Inactive Publication Date: 2018-06-01
SHENZHEN DARBOND INTERFACE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual use of thermally conductive phase change materials, it is relatively difficult to repair electronic components: thermally conductive phase change materials are firmly bonded to electronic components, and electronic components are easily damaged during the repair process, which increases the cost of repair
The removal methods of phase change materials attached to electronic components include: heating removal, solvent dissolution removal, direct peeling, etc. These methods are likely to damage electronic components

Method used

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  • Removable thermal-conductive phase change material and preparation method thereof
  • Removable thermal-conductive phase change material and preparation method thereof
  • Removable thermal-conductive phase change material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A removable heat-conducting phase-change material, its components include by weight parts: base resin silicone rubber 56.2g, reinforcing agent active whisker silicon 4g, tackifier hydrogenated rosin resin 36g, anti-aging agent 2, 0.5g of 8-di-tert-butyl-4-methylphenol, 7g of coupling agent KH550, 3.5g of flame retardant melamine phosphate, 200g of heat-conducting particulate titanium dioxide, 1g of heat-dissipating graphene particles, and 100g of heat-dissipating particles of zinc oxide.

[0021] The preparation method of the above-mentioned removable heat-conducting phase-change material, the steps are as follows:

[0022] (1) 56.2g of base resin silicone rubber, 4g of reinforcing agent active whisker silicon, 36g of tackifier hydrogenated rosin resin, 0.5g of anti-aging agent 2,8-di-tert-butyl-4-methylphenol, and even Add KH5507g of joint agent and 3.5g of flame retardant melamine phosphate into the stirring tank, heat and stir for 160min at a speed of 55rpm and a tem...

Embodiment 2

[0025] A removable heat-conducting phase-change material, the components of which include by weight parts: base resin ethylene propylene rubber 34.1g, reinforcing agent active whisker silicon 11g, tackifier hydrogenated rosin resin 84g, anti-aging agent 2 , 8-di-tert-butyl-4-methylphenol 0.5g, coupling agent tribenzyl chlorate 10g, flame retardant melamine phosphate 7.3g, heat conduction particle carbon black 150g, heat dissipation particle graphene 4g and heat dissipation particle oxidation Zinc 150g.

[0026] The preparation method of the above-mentioned removable heat-conducting phase-change material, the steps are as follows:

[0027] (1) Base resin ethylene propylene rubber 34.1g, reinforcing agent active whisker silicon 11g, tackifier hydrogenated rosin resin 84g, antiaging agent 2,8-di-tert-butyl-4-methylphenol 0.5g, Add 10g of the coupling agent tribenzyl chlorate and 7.3g of the flame retardant melamine phosphate into the stirring tank, heat and stir for 160min, the ...

Embodiment 3

[0030] A removable heat-conducting phase-change material, the components of which include: base resin SBS63.2g, reinforcing agent active whisker silicon 10g, tackifier C5 petroleum resin 20g, anti-aging agent 2, 1.3g of 8-di-tert-butyl-4-methylphenol, 5g of coupling agent tribenzyl chlorate, 6.4g of flame retardant aluminum hydroxide, 150g of heat-conducting particles of aluminum oxide, 1g of heat-dissipating particles of graphene and heat-dissipating particles of zinc oxide 150g.

[0031] The preparation method of the above-mentioned removable heat-conducting phase-change material, the steps are as follows:

[0032] (1) Add base resin SBS 63.2g, reinforcing agent active whisker silicon 10g, tackifier C5 petroleum resin 20g, anti-aging agent 2,8-di-tert-butyl-4-methylphenol 1.3g, di-tert-butyl-4-methylphenol 1.3g, Add 5g of tribenzyl chlorate and 6.4g of flame retardant aluminum hydroxide into the stirring tank, heat and stir for 160min, the speed is 65rpm, and the temperatur...

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Abstract

The invention belongs to the technical field of polymer materials and particularly relates to a removable thermal-conductive phase change material and a preparation method thereof. The material prepared by the preparation method can be removed through a tensile deformation mode, the phenomenon that an electronic element is polluted cannot occur in the removing process, the phase change thermal conductive effect is good, and the thermal-conductive phase change material has good thermal conductivity and removability and is easily removed after being attached to the electronic element. The tensile deformation removal principle of the material prepared by the preparation method is that for a viscous material, the viscosity is relative to the thickness of the material, and in a certain thickness range, the viscosity of the material is lowered as the thickness of the material is reduced (being stretched), and the material become easily stripped.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a removable heat-conducting phase-change material and a preparation method thereof. Background technique [0002] Thermal conduction phase change material is a material with both phase change and heat conduction functions. Its phase change function is to provide over-temperature protection for electronic components and reduce the probability of overheating of electronic components; its heat conduction function is to transfer the heat generated by electronic components to the outside world. . However, in the actual use of thermally conductive phase change materials, it is relatively difficult to repair electronic components: thermally conductive phase change materials are firmly bonded to electronic components, and electronic components are easily damaged during the repair process, which increases the cost of repair. The removal methods of the phase change m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L93/04C08L23/16C08L53/02C08K13/04C08K7/06C08K3/22C08K3/04C08K5/13
CPCC08K2003/2227C08K2003/2241C08K2003/2296C08K2201/014C08L23/16C08L53/02C08L83/04C08L93/04C08K13/04C08K7/06C08K3/22C08K3/04C08K5/13C08L57/02
Inventor 邹海仲万炜涛陈田安
Owner SHENZHEN DARBOND INTERFACE MATERIALS