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Substrate drying device and substrate processing method

A drying device and substrate technology, applied in the direction of drying gas arrangement, drying solid materials, progressive dryers, etc., can solve problems such as dirt, and achieve the effect of reliable removal

Inactive Publication Date: 2007-05-23
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the air pressure ejected from the air knife 1 is too strong, the rinse liquid 3 may float up in the form of mist 5, and if the mist 5 adheres to the substrate 2 again, fouling will occur.
Therefore, there is a limit in improving the drying efficiency by enhancing the air pressure ejected from the air knife 1

Method used

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  • Substrate drying device and substrate processing method
  • Substrate drying device and substrate processing method
  • Substrate drying device and substrate processing method

Examples

Experimental program
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Effect test

Embodiment approach 1

[0025] The embodiments of the present invention will be described in detail below using the drawings. In this embodiment, in a substrate drying device with an air knife drying mechanism, by changing the angle of the gas jetted from the air knife, the jetting angle of the drying gas at the end of the substrate is made parallel to the edge of the substrate as much as possible to improve the drying efficiency And suppress the residue of water droplets.

[0026] Fig. 1 is a diagram of an air knife drying mechanism in a substrate drying apparatus of the present embodiment viewed from above. The substrate 120 to be dried is a substantially square substrate as shown in the figure. In FIG. 1, the side on the lower side of the substrate 120 is referred to as the lower side 120a, and the side on the right side is referred to as the right side 120b. The substrate 120 is transported by a transport roller or the like in the direction of the movement direction A indicated by the arrow in the fi...

Embodiment approach 2

[0052] The second embodiment of the present invention will be described using FIG. 4. The air knife 110 shown in FIG. 4 is bent at a bending portion 111 with a predetermined radius of curvature. In addition, the air knife 110 is bent within the range of the angle J at the bent portion 111. Therefore, the angle at which the discharge port 112 is provided can be changed. In this way, the direction of the component parallel to the substrate surface in the ejection direction B can be changed, and the angles E and F at the substrate end portions 121 and 122 can be reduced.

[0053] In the embodiment of FIG. 4, the ejection port 112j at the bent portion 111 is bent within the angle J range. That is, the angle of the air knife 110 is changed within the range of the angle J shown in FIG. 4 instead of at one point as shown in FIG. 1. Therefore, the drop in the injection pressure of the dry gas in the direction of the arrow H shown in FIG. 1 can be dispersed within the range of the angle J....

Embodiment approach 3

[0055]The third embodiment of the present invention will be described using FIG. 5. The air knife 110 shown in FIG. 5 changes the angle at two points of the bent portions 113 and 114. That is, the discharge port 112c is arranged between the discharge port 112a on the upstream side and the discharge port 112b on the downstream side. Here, assuming that the angle formed by the ejection port 112c and the moving direction A is K, the relationship between the angles C, K, and D is C>K>D. That is, from the upstream side to the downstream side, the ejection port 112 gradually approaches the upper side facing the lower side 120a of the substrate. In the air knife shown in FIG. 5, the angle of the air knife 110 is changed not at one point as shown in FIG. 1, but at two bending portions 113 and 114. In this way, the change in the spray direction B of the dry gas can be dispersed at two points, and the reduction in the gas spray pressure at the bent portions 113 and 114 can be suppressed.

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Abstract

The present invention provides a substrate drying device capable of securely removing a water droplet remaining on a substrate without increasing an air pressure and a substrate processing method. The substrate drying device according to an embodiment of the present invention includes: a nozzle ejecting a fluid to a substrate to be processed, wherein the substrate is moved relative to the nozzle while the nozzle is spraying the fluid to dry the substrate, a parallel component to a surface of the substrate in an ejection direction of the fluid is inclined with respect to a moving direction in which the substrate moves relative to the nozzle, and an angle between the parallel component to a surface of the substrate in an ejection direction of the fluid is inclined and the moving direction is changed at a changed portion in a predetermined position of the nozzle.

Description

Technical field [0001] The invention relates to a substrate drying device and a substrate processing method. Background technique [0002] Conventionally, the following technology has been adopted in which, when drying the substrate in the cleaning process of the liquid crystal glass substrate or semiconductor wafer in the manufacturing process of a liquid crystal display device or a semiconductor device, the substrate is transported in one direction and ejected from an air knife Dry gas to dry the surface of the substrate. Such techniques are disclosed in Patent Documents 1 and 2, for example. [0003] Using FIGS. 7 and 8, the conventional air knife drying mechanism will be described. Fig. 7 is a view of a conventional air knife drying mechanism viewed from above, and Fig. 8 is a cross-sectional view taken along the line Z-Z' in Fig. 7. As shown in the figure, an air knife 1 is arranged on the upper surface of the substrate 2, the substrate 2 is transported in the direction of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F26B15/00F26B3/06
CPCF26B21/004F26B5/14H01L21/67034
Inventor 西浦笃德
Owner MITSUBISHI ELECTRIC CORP