Encapsulation structure of optical sensor with gap wall

Abstract

This invention relates to one light sensor package structure with gap by use of gap wall position and size to block outside dirty light sensor area and local glue layer overflow range in two glue layers to avoid current technique glue overflow light sensor area and metal ball regeneration. This invention can reduce small sealing area and to improve product rate and quality.

Description

technical field [0001] The present invention relates to a light sensor package structure, in particular to a light sensor package structure with spacers. Background technique [0002] With the prevalence of audio-visual multimedia, image digitization has become an inevitable trend. The launch of digital cameras, conventional video cameras and image scanners and other products represents the advent of the era of image digitization, and CMOS is one of the important technologies that determine this digital age. , the quality, cost and humanization of its products are the key to the success or failure of enterprises in this competition. [0003] Please refer to FIG. 1, which is the package structure of an existing CMOS photosensor (CMOS image sensor). Metal balls (solder balls) 14 to form an electrical connection with the metal wiring 12; an optical sensing component 16, which includes a photo-sensing region (sensing region) 18, a plurality of welding pads 20 (pads), on which ...

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Problems solved by technology

[0004] But above-mentioned structure, when forming colloidal layer 17, often because the colloid of colloidal layer 17 has fluidity slightly, so the situation that colloidal control is not easy to take place quite easily, for example, when the welding pad 20 on the photosensitive element 16 and the light When the sensing area 18 is too close, the colloid will overflow to the photo-sensing area 18, causing the photo-sensing malfunction; The area of ​​the metal ball 14 pollutes the metal ball 14. At this time, when the metal ball 14 goes through the reflow (SMT IR Reflow) process, it will cause a loss of yield in the process.

In particular, it should be noted that the distance between the solder pad 20 and the metal ball 14 will be shortened day by day due to the trend of light, thin, short, and small requirements for the above two situations, and the pollution problem will become more and more serious. Seriously affect the process cost and product yield

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