Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optical inspection method and optical inspection apparatus used for the same

An optical inspection and light source technology, applied in the field of optical inspection, can solve the problems that the measurement results are easily affected by the ambient temperature, and it is difficult to apply optical inspection machines, etc., and achieve the effect of less environmental temperature influence

Inactive Publication Date: 2007-06-27
KK TOSHIBA
View PDF2 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] As described above, in a medical optical inspection device that uses a plate-shaped glass chip with a sensor detection function and an optical signal obtained by irradiating light to the plate-shaped glass chip to determine the sensor detection result, the measurement result is easily affected by the environment. Effect of temperature
In order to obtain accurate sensor detection results, it is effective to adjust the temperature of the light source, but there is a problem that it is difficult to apply to a hand-held optical inspection machine that can be transported.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optical inspection method and optical inspection apparatus used for the same
  • Optical inspection method and optical inspection apparatus used for the same
  • Optical inspection method and optical inspection apparatus used for the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0031] Light from a laser diode or the like used in this embodiment has extremely high coherence, and such highly coherent light tends to change in wavelength shift and spectral distribution due to temperature changes. If such light sensitive to temperature changes is used, the reliability of the measurement results will decrease if there is a temperature change during the measurement. In the present embodiment, in the optical inspection device, by suppressing the temperature rise of the light source serving as the heat source for the sensor chip, the decrease in the accuracy of the inspection result due to the temperature rise is avoided.

[0032] (check device)

[0033] Hereinafter, the inspection apparatus of this embodiment is demonstrated using FIG. 1 which is a schematic diagram of the optical inspection apparatus of this embodiment.

[0034] In FIG. 1, 1 is an optical inspection device. This optical inspection device mainly includes a frame body 2 formed of a material ...

no. 2 Embodiment approach

[0055] The inspection device of this embodiment functions in such a manner that, in the inspection device of the first embodiment, before the inspection light irradiated from the light source is irradiated onto the sensor chip, it passes through the diffuser plate, so that the inspection light Even if the characteristics of the light change, even if the coherence is lowered, the ease with which the inspection light is affected by heat is eased, and even if the quality of the light beam output from the light source is changed, the change is moderated before it enters the chip.

[0056] Hereinafter, the inspection device of this embodiment is shown in FIG. 3 which is a schematic cross-sectional view thereof. In FIG. 3 , the same components as those of the inspection device in FIG. 1 are assigned the same reference numerals, and detailed description thereof will be omitted.

[0057] As shown in FIG. 3, in this inspection device, the inspection light radiated from the light source...

no. 3 Embodiment approach

[0063] This embodiment is an embodiment for preventing the heat generated by turning on the light source from reaching the sensor chip, and is characterized in that the light source is fixed via a mechanism part that uses a material (thermal insulating material) with a thermal conductivity of 1.0 W / m·K or less. on the frame.

[0064] FIG. 4 shows a schematic diagram of the inspection device of this embodiment. In FIG. 4, components having the same functions as those in FIG. 1 are given the same reference numerals, and detailed descriptions thereof are omitted.

[0065] In the inspection device of the present embodiment, as shown in FIG. 4 , the light source 8 is fixed to the housing 2 by a fixing member 14 formed of a heat insulating material. Therefore, even if the external temperature of the optical inspection device changes, the heat is blocked by the thermally insulating fixing member 14 without affecting the temperature of the light source 8, and the change in the beam q...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thermal conductivityaaaaaaaaaa
Login to View More

Abstract

An inspection method using a portable optical inspection apparatus adapted to be driven by a battery and capable of producing an accurate sensing result without being adversely affected by the environmental temperature conditions is disclosed. The light is radiated on a sensor chip for a predetermined length of time and the amount of a substance contained in a specimen placed on a sensing thin film is measured by an optical signal obtained from the sensing chip, using an optical inspection apparatus comprising the sensor chip including a substrate 5 , an optical waveguide layer 6 arranged on the substrate and the sensing thin film 7 attached on the surface of the optical waveguide layer, a light source 8 for radiating the light on the sensor chip and a photodetector 9 for receiving and converting the light output from the sensor chip into an electrical signal The light source is turned on and off a plurality of times for a predetermined length of time during which the inspection light is radiated. The amount of light with the light source on is measured by the photodetector thereby to determine the amount of the substance. In the process, the light amount with the light source off can also be measured so that the amount of the substance is determined from the difference between the light amount with the light source on and off.

Description

technical field [0001] The present invention relates to an optical inspection technique for measuring the amount of a substance in a sample, and particularly relates to an optical inspection method including an optical waveguide sensor and a transportable optical inspection device. Background technique [0002] Currently, research, development, and practical use of medical sensors such as immunosensors are being actively carried out, and attention is paid to using optical waveguide sensors as medical sensors. This so-called optical waveguide sensor is composed of a plate-shaped light-transmitting substrate as an optical waveguide layer, and a thin film with a sensing and detection function bonded to its surface. The inspection light that is totally reflected on one side and propagated on the other side is used to detect the change of physical properties on the sensing film caused by the chemical or physical interaction between the biological tissue or biological tissue fluid...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/27G01N33/53G01N21/552
CPCG01N21/648G01N21/553G01N21/7703
Inventor 高濑智裕植松育生绳田功
Owner KK TOSHIBA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products