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Method for detecting substrate surface film thickness

A technology for detecting substrates and surface films, applied in measuring devices, electromagnetic measuring devices, electric/magnetic thickness measurements, etc., can solve problems such as large time fluctuations, reduce air bubbles, overcome large time fluctuations, and reduce distances Effect

Inactive Publication Date: 2007-07-11
SHANGHAI SVA LIQUID CRYSTAL DISPLAY
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Problems solved by technology

[0002] As shown in Figure 1, the liquid crystal display manufacturing process wet etching equipment detects the film thickness of the substrate surface through the end point sensor (EndPoint Sensor EPS). The principle of EPS sensor detection substrate is to emit light through the light emitting diode (LED) element on the light projection side The light-receiving side 5 converts the amount of light passing through the substrate into a voltage, and judges the film thickness of the substrate surface according to the voltage value. When the existing sensor detects the film thickness of the substrate surface, the light-emitting side 4 and the light-receiving side of the EPS The distance between 5 and the center passing line 6 is 5mm, and there is a defect of large time fluctuations

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  • Method for detecting substrate surface film thickness

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Embodiment Construction

[0009] The preferred embodiments of the present invention are given below in conjunction with the accompanying drawings to describe the technical solution of the present invention in detail.

[0010] A method for detecting the film thickness on the surface of a substrate, which uses an endpoint measurement sensor to detect the film thickness on the surface of the substrate. The amount of light passing through the substrate is converted into a voltage, and the film thickness on the surface of the substrate is judged based on the magnitude of the voltage.

[0011] The distance from the light-emitting side 1 to the center passing line 3 of the endpoint measurement sensor and the distance from the light-receiving side 2 to the center passing line 3 are both 3 mm, thereby reducing the air bubbles between the EPS and the substrate, and making the fluctuation of the EPS very well improve.

[0012] Cr-WET#1 data comparison before and after improvement:

[0013] before imp...

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Abstract

The inspection of the surface film thickness of the base plate uses the terminal inspection sensor to project light with the distance between of the center line with either project side or light receiving side 3mm. It reduces the distance between EPS and the base plate and the bubbles between them, getting rid of the big time fluctuation, with simple structure, and low cost.

Description

technical field [0001] The invention relates to the field of liquid crystal display manufacturing process wet etching equipment, in particular to a method for detecting film thickness on the surface of a substrate. Background technique [0002] As shown in Figure 1, the wet etching equipment of the liquid crystal display manufacturing process detects the film thickness of the substrate surface through the end point sensor (EndPoint Sensor EPS). The light-receiving side 5 converts the amount of light passing through the substrate into a voltage, and judges the film thickness of the substrate surface according to the voltage value. When the existing sensor detects the film thickness of the substrate surface, the light-emitting side 4 and the light-receiving side of the EPS The distances between 5 and the center passing line 6 are both 5mm, which has the disadvantage of large time fluctuations. Contents of the invention [0003] The purpose of the present invention is to ove...

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Application Information

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IPC IPC(8): G01B11/06G01B7/06
Inventor 谢宇
Owner SHANGHAI SVA LIQUID CRYSTAL DISPLAY