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A thermal concretion PTC thermal resistor and its making method

A thermistor and thermosetting technology, applied in the direction of resistors with positive temperature coefficient, etc., can solve the inconvenience of polymer PTC thermistor and other problems, and achieve the effect of excellent performance and simple process of finished products

Active Publication Date: 2011-03-30
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the manufacturing process of PTC thermistor with thermoplastic resin as the polymer base material, it needs to go through complex processes such as multiple processing and molding of polymer composite materials, heat treatment and radiation crosslinking.
This brings a lot of inconvenience to the preparation of polymer PTC thermistor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A thermosetting PTC thermistor, which consists of a core material and a metal foil attached to both sides of the core material, a pin welded on the outer surface of the metal foil, and an insulating layer covering the outside. The core material It is cured by conductive polymer material, wherein the conductive polymer material is mixed with thermosetting resin, curing agent, nickel powder and other additives, wherein the thermosetting resin is epoxy resin or silicone Resin or its composition; The curing agent is one or a combination of liquid anhydrides, aliphatic amines, aliphatic amides, aromatic tertiary amines, boron amines; other additives include curing accelerators, flame retardants, One or a combination of suspending agents.

[0034] The thermosetting resin is epoxy resin mixed with organic silicon, and the mixing ratio (by weight percentage) of the two is: epoxy resin / organic silicon: 40:60~60:40; the epoxy equivalent of epoxy resin is 150 ~300g / eq.

[0035] ...

Embodiment 2

[0043] The manufacturing method is all the same as in Example 1, except that the formulation of each component is different, and the formulation is (by weight): 15% of thermosetting resin, 15% of curing agent, 65% of nickel powder and 5% of other additives.

Embodiment 3

[0045] The manufacturing method is all the same as in Example 1, except that the formulation of each component is different, and the formulation is (by weight): 20% of thermosetting resin, 20% of curing agent, 55% of nickel powder and 5% of other additives.

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PUM

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Abstract

This invention relates to heat fix PTC sensitive resistance and to one conductive macromolecule materials element structure and its process method, wherein, the macromolecule is composed of heat fix resin, fix agent, nickel powder and other addition agent, the formula is as follows: heat fix resin 10-30%; fix agent 10-30%; nickel powder 30-75%; other addition agents 5-10%, wherein the said heat fix resin is epoxy resin or organosilicon resin or their composition; the said fix agent is liquid acid anhydride, etc; other addition agents include one of or combination of fix accelerant, anticombustion agent, suspending agent. The process method comprises the following steps: putting elements into container for 5 to 60 minutes under 40 to 100 degrees; filing the plasma into metal electrode surface and coating other layer of metal electrode on top; after molding and shaping to process the molecule PTC materials; cutting and welding to final product.

Description

technical field [0001] The invention relates to the manufacture of electronic components with conductive polymer composite material as the main raw material, in particular to a thermosetting polymer PTC thermistor and a manufacturing method thereof. Background technique [0002] Thermoplastic resins have been widely used in the manufacture of polymer PTC thermistors. Generally, a positive temperature coefficient (PTC) phenomenon can be exhibited in a crystalline or semi-crystalline polymer composite material filled with conductive particles. That is, at lower temperatures, such conductors exhibit low resistivity, and when the temperature rises above the melting point of its polymer, which is the so-called "shutoff" temperature, the resistivity rises sharply. high. Current conventional thermoplastic polymer materials include polyethylene, polypropylene, polystyrene, EVA, EAA, EBA, and conductive fillers include carbon black, graphite, carbon fiber, nickel powder, copper pow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/02
Inventor 王强侯李明王军
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD