Apparatus and method for manufacturing a semiconductor package

Abstract

An apparatus is provided for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. Also provided is a method that includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. According to the present invention, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip so the resin spreads throughout the entire gap at substantially the same time as it flows along the peripheral portion of the chip. Thus, the formation of resin-less voids in the gap is deterred so that the grade and quality of the semiconductor device is improved.

Description

BACKGROUND OF THE INVENTION1. This invention relates to an apparatus and method for manufacturing a flip-chip-type semiconductor package, and more specifically to an apparatus and method for manufacturing a semiconductor package in which formation of a resin-less void in the gap between the semiconductor chip and a mount board is suppressed, so that the grade and quality of the semiconductor device is improved.2. There has recently been developed a "flip-chip" method for packaging semiconductor chips. The flip-chip method produces a small semiconductor package in which a semiconductor chip is bonded to a mount board. Typically, solder bumps are formed on the electrode pads of the semiconductor chip, and the solder bumps are connected to the pads and wiring of the mount board. A resin is filled in a gap between the semiconductor chip and the mount board to secure the package. FIG. 1 shows a conventional method for fabricating a semiconductor package that has a semiconductor chip and ...

AI Technical Summary

Benefits of technology

6. In view of these problems, it is an object of the present invention to remove the above-mentioned drawbacks and to provide an apparatus and method for manufacturing a semiconductor package in which the formation of resin-less voids is deterred so that the grade and quality of the semiconductor device is improved.

7. To achieve this object, one preferred embodiment of the present invention provides an apparatus for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The apparatus includes resin supply means for supplying the resin along one side of the semiconductor chip, and resin supply control means for controlling the amount of resin supplied by the resin supply means such that more resin is supplied near the central portion of the semiconductor chip than near the end portions of the semiconductor chip. The apparatus supplies the resin such that it is relatively less concentrated near the peripheral portions of the chip, and thus the rate at which the resin flows near the peripheral portions of the chip is reduced. As a result, the formation of resin-less voids is deterred.

8. In another preferred embodiment of the present invention, the object is achieved by providing a method for manufacturing a semiconductor package of the type in which a gap between a semiconductor chip and a mount board is filled with a resin. The method includes the steps of connecting the semiconductor chip and the mount board, and supplying the resin along one side of the semiconductor chip in such a manner that more resin is supplied near a central portion of the semiconductor chip than near the end portions of the semiconductor chip. Accordingly, the resin is supplied such that it is relatively less concentrated near the peripheral portions of the chip. As a result, the formation of resin-less voids is deterred.

Problems solved by technology

However, the rate at which the resin enters the gap between the chip and mount board is typically lower than the rate at which the resin advances around the periphery of the semiconductor chip.

Thus, using the conventional method in which the resin is uniformly supplied by a syringe driven at a constant speed, it is difficult to completely fill the gap between the semiconductor chip and the mount board.

The void 7 lowers the grade and quality of the semiconductor device because it can lead to defects or cracks.

More specifically, moisture entering the void can deteriorate the solder bridge, short-circuit the wiring elements on the mount board, or crack the semiconductor device.

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