Kinematic coupling

a kinematic coupling and coupling technology, applied in the direction of coupling device connection, instruments, manufacturing tools, etc., can solve the problems of circuits (ic's), ic's tend to fail early in their projected life, and loss of added packaging costs,

Inactive Publication Date: 2002-01-03
AEHR TEST SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is well known that integrated circuits (IC's), if they are going to fail, tend to fail early in their projected lives.
To identify and eliminate such fragile IC's, IC manufacturers typically expose their integrated circuits to conditions that tend to induce such premature failure.
Disadvantages of burning-in packaged IC's are that the added expense of packaging the IC is lost if the IC fails during burn-in, that there are many more individual components to handle, and that th

Method used

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Embodiment Construction

[0038] A wafer-level burn-in and test cartridge according to the invention is illustrated in FIG. 1. The cartridge, generally indicated by the reference numeral 10, comprises a chuck plate 12 and a probe plate 14. The chuck plate 12 and the probe plate 14 may be made of any suitable material. In the illustrated embodiment, the chuck plate 12 and the probe plate 14 are made of 6061 aluminum.

[0039] The chuck plate 12 is generally rectangular in shape, and includes a centrally-located raised pedestal 16. In use, a semiconductor wafer is placed on the upper surface 18 of the pedestal 16. Mounted to the upper surface of the chuck plate 12 are the lower halves 20 of three mechanical connecting devices that are used to lock the chuck plate 12 and the probe plate 14 together in use. In the illustrated embodiment, the mechanical connecting devices are kinematic couplings, which are discussed below in more detail with reference to FIGS. 6 to 12. Formed transversely through the chuck plate 12 ...

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Abstract

A kinematic coupling includes a male connector (94) and first and second opposed jaws (122, 124.) Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force when the kinematic coupling is engaged.

Description

[0002] 1. Technical Field[0003] This invention particularly relates to a cartridge for use in the burn-in and / or test of circuitry formed on semiconductor wafers, before the wafer is diced. The invention may however also be applicable to the burn-in or test of other electrical devices. This invention further relates to methods of loading and aligning a probe card in the cartridge with a semiconductor wafer located in the cartridge. The invention also relates to a connecting device for use in the cartridge. This invention is related to the inventions in commonly owned U.S. Pat. No. 5,429,510, issued to Barraclough et al. on Jul. 5, 1995, entitled "High-Density Interconnect Technique," and commonly owned U.S. Pat. No. 5,682,472, issued to Brehm et al. on Oct. 28, 1997 and entitled "Method and System for Testing Memory Programming Devices," the disclosures of which are hereby incorporated by reference herein. This invention is further related to the invention in a concurrently filed, c...

Claims

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Application Information

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IPC IPC(8): B23Q1/00F16B5/06F16B21/16G01R1/04G01R31/28
CPCB23Q1/0072F16B5/0628F16B5/0657F16B21/16G01R1/045G01R31/2886
Inventor UHER, FRANK OTTOANDBERG, JOHN WILLIAMCARBONE, MARK CHARLESRICHMOND, DONALD PAUL II
Owner AEHR TEST SYST
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