Material having characteristics of high thermal conductivity and electromagnetic interference resistance

Abstract

A compound material at least comprises a pair of overlapped high heat conductive layer and electromagnetic interference (EMI) shielding layer. The EMI shielding layer includes a high heat conductive sub-layer and a plurality of EMI shielding blocks thereby forming an EMI shielding net and a heat conducting track with the cooperation of the overlapped heat conductive layer in the meantime. The compound material further comprises a second EMI shielding layer overlapped on the side of the heat conductive layer which is opposite to said EMI shielding layer and having a plurality of EMI shielding blocks, which are arranged in a similar as and are staggered from the EMI shielding blocks of said EMI shielding layer in the overlapped or vertical direction thereof.

Description

[0001] The present invention relates to a compound material, especially to a compound material having both the characteristics of super thermal conductivity and electromagnetic interference resistance in the meantime.DESCRIPTION OF RELATED ARTS[0002] Electronic or electrical devices, especially those running with high power, are inevitably confronted with the problem of thermal dissipation. The traditional method to solve this problem is to additionally equip themselves with a special means or device to dissipate heat occurred therefrom, for example, a forcible convection system consisted of one or more fan fins.[0003] However, as far as those small or micro electronic elements such as a CPU, which are used in compression circumstances, for example, are mounted on printed circuit boards, it's far from enough to use said forcible convection system to solve the heat dissipation problem because no enough heat dissipation area can be available. Hence, at least a radiator like device wit...

AI Technical Summary

Benefits of technology

[0017] Furthermore, the positions of the EMI shielding blocks in different EMI shielding layers are staggered relative to the positions of the EMI shielding blocks in the first EMI shielding layer in the overlapping or vertical direction. Therefore, the accordingly staggered heat conductive portions of the high heat conductive sub-layers of the EMI shielding layers and the overlapped heat conductive layers can form a heat conducting track which is staggered, consecutive and sinuous, which can guarantee the high thermal conductivity of the compound material in accordance with the present invention.

[0018] In the meantime, since each EMI shielding layer has tessellatedly distributed EMI shielding material blocks and the EMI shielding blocks of different EMI shielding layers are staggered from each other in the overlapping direction thereof, a complete electromagnetic waves absorbing net is thus formed, which can ensure the super EMI shielding performance of the compound material in accordance with the present invention.

[0019] In addition, the compound material in accordance with the present invention can be made into various shapes as desired, and then positioned onto correspondent electronic elements or devices. Hence, no additional circuitry design is needed with the application of the present invention which results in advantages of easy use and reliability, etc.

Problems solved by technology

Electronic or electrical devices, especially those running with high power, are inevitably confronted with the problem of thermal dissipation.

However, as far as those small or micro electronic elements such as a CPU, which are used in compression circumstances, for example, are mounted on printed circuit boards, it's far from enough to use said forcible convection system to solve the heat dissipation problem because no enough heat dissipation area can be available.

But, when said devices are mounted onto the CPU, a small space will unavoidably be left therebetween which will allow air to be filled therebetween.

Since air is not a good heat conductor, the performance of the whole heat dissipation system will be adversely affected.

Furthermore, when the electronic elements work, special measures still have to be adopted to overcome the electromagnetic interference (EMI) problem which is brought to other surrounding electronic elements because of the running with high speed or under high power, otherwise the other electronic elements may not be able to work normally.

However, the shell can only perform its anti EMI and heat dissipation functions when it is connected to a grounding means set on the PCB.

As a result, corresponding additional circuitries shall be pre-set on the PCB, which not only complicate the according circuit design, but also occupy the very limited space of the PCB.

As the total amount of the soft magnetic powder and thermal conductive powder which is allowed in the organic bonding material is limited, the according performance of both heat conduct and EMI resistance is not as good as expected.

Although the resulted material is soft and has good heat conductivity, it can not be used to shield EMI.

Such measures can increase heat conducting effects thereof, however, it will decrease the electromagnetic wave absorbing effects thereof.

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