Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate

a technology of chemical processing and transfer apparatus, which is applied in the direction of cleaning with liquids, charge manipulation, furnaces, etc., can solve the problems of difficult to apply a large amount of tension to the tape substrate, complex transfer control, and deterioration of the quality of the tape substrate, so as to prevent the tension from increasing, reduce the tension applied to the object to be transferred, and prevent the effect of complex transfer control

Inactive Publication Date: 2005-01-13
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0008] Accordingly, it is an advantage of the present invention to provide a transfer apparatus, a cleaning apparatus, a chemical processing apparatus and a method for manufacturing a circuit substrate, which can prevent the transfer control from becoming complex, and can prevent the tension from increasing.
[0009] To solve the aforementioned problems, a transfer apparatus in accordance with an embodiment of the present invention includes a reservoir tank that stores fluid fluid supply unit that supplies the fluid into the reservoir tank such that the fluid overflows from the reservoir tank and a transfer device that transfers an object to be transferred while floating the object to be transferred on the fluid.
[0010] Accordingly, the object to be transferred can be transferred while sliding the object to be transferred on the fluid, such that a surface for holding the object to be transferred can be planarized. For this reason, the tension applied to the object to be transferred can be reduced, and the object to be transferred can be transferred without inflicting damage to the object to be transferred. Also, by overflowing the fluid from the reservoir tank, the object to be transferred can be transferred on the fluid, the transfer control is prevented from becoming complex, and an increase in the cost of the transfer apparatus can be prevented.
[0011] Also, a transfer apparatus in accordance with an embodiment of the present invention includes a support member that supports an object to be tran...

Problems solved by technology

However, the application of a large tension to the tape substrate at the time of transferring the tape substrate causes problems in that distortions and/or bends occur in the tape substrate, and thus the quality of the tape substrate deteriorates.
In particular, when the tape substrate is wide, or the tape substrate is thin, it becomes almost impossible to appl...

Method used

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  • Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate
  • Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate
  • Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate

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first embodiment

[0030]FIG. 1 schematically shows a cross section of the structure of a cleaning apparatus in accordance with the present invention.

[0031] Referring to FIG. 1, a cleaning liquid reservoir tank 3 stores cleaning liquid 8, and a cleaning liquid supply unit 4 is provided for overflowing the cleaning liquid 8 from the cleaning liquid reservoir tank 3. Also, a cleaning liquid jetting unit 1 for jetting the cleaning liquid 8 is provided above the cleaning liquid reservoir tank 3, and nozzles 2 that jet the cleaning liquid 8 onto a tape substrate 9 are provided at the cleaning liquid jetting unit 1.

[0032] Also, below the cleaning liquid reservoir tank 3 is provided a cleaning liquid collecting tank 5 for collecting the cleaning liquid 8 that is jetted from the cleaning liquid jetting unit 1 and the cleaning liquid 8 that overflows from the cleaning liquid reservoir tank 3. Further, a pump 6 is provided for sending the cleaning liquid 8 collected in the cleaning liquid collecting tank 5 to ...

second embodiment

[0039]FIG. 2 schematically shows a cross section of the structure of a cleaning apparatus in accordance with the present invention. Referring to FIG. 2, a cleaning liquid flowing unit 13 that flows cleaning liquid 18 is provided with cleaning liquid supply units 14 that supply the cleaning liquid 18 onto the cleaning liquid flowing unit 13, and cleaning liquid jetting nozzles 13a for jetting the cleaning liquid 18 sent out from the cleaning liquid supply units 14 along a transfer direction of a tape substrate 19. Also, a cleaning liquid jetting unit 11 for jetting the cleaning liquid 18 is provided above the cleaning liquid flowing unit 13, and nozzles 12 that jet the cleaning liquid 18 onto the tape substrate 19 are provided at the cleaning liquid jetting unit 11.

[0040] Also, below the cleaning liquid flowing unit 13 is provided a cleaning liquid collecting tank 15 for collecting the cleaning liquid 18 that is jetted from the cleaning liquid jetting unit 11 and the cleaning liquid ...

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Abstract

A transfer apparatus includes a reservoir tank that stores a fluid, a supply device that supplies the fluid into the reservoir tank such that the fluid overflows from the reservoir tank, and a transfer device that transfers an object to be transferred while floating the object to be transferred on the fluid.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a transfer apparatus, a cleaning apparatus, a chemical processing apparatus, and a method for manufacturing a circuit substrate, and more particularly, is preferably applicable to a wet processing for flexible circuit substrates. [0003] 2. Description of Related Art [0004] Relating to the conventional cleaning apparatuses, for example, there is a method for cleaning a tape substrate by jetting a cleaning liquid onto the tape substrate while transferring the tape substrate. Here, when the tape substrate is transferred, the tape substrate is supported by rollers. For this reason, the conventional cleaning apparatus applies a large tension to the tape substrate to prevent the tape substrate from slacking between the rollers so as to stably transfer the tape substrate. [0005] However, the application of a large tension to the tape substrate at the time of transferring the tape substrate ...

Claims

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Application Information

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IPC IPC(8): B08B11/00B08B3/02B08B3/04B65G49/00B65G51/01C23F1/08C23G3/02H01L21/00H05K1/00H05K3/00H05K3/26
CPCB08B3/022B08B3/041C23F1/08C23G3/02H05K2203/1545H05K1/0393H05K3/0085H05K3/26H05K2203/075H01L21/67051
Inventor GOMI, TSUGIO
Owner SEIKO EPSON CORP
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