Microelectronic assemblies with composite conductive elements
a technology of composite conductive elements and microelectronic assemblies, which is applied in the direction of dielectric characteristics, sustainable manufacturing/processing, and final product manufacturing, etc., can solve the problems of severe strain on electrical elements connecting the chip and the substrate, component shrinkage or contraction, and further movement of the chip relative to the substrate, so as to facilitate the movement of the microelectronic elements, reduce the amount of relatively expensive low-melting alloy, and facilitate the effect of microelectronic elemen
Inactive Publication Date: 2005-06-23
TESSERA INC
View PDF24 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Benefits of technology
This solution provides reliable, fatigue-free electrical and thermal connections that accommodate differential thermal expansion, reducing stress on connections and maintaining reliability while being economical by minimizing the use of expensive materials.
Problems solved by technology
When operation ceases, the chip and the substrate cool down which causes the components to shrink or contract.
The chip and the substrate can also warp as they are heated and cooled, thereby causing further movement of the chip relative to the substrate.
The repeated expansion and contraction of the elements during operation results in severe strain on electrical elements connecting the chip and the substrate.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0023] One embodiment of the present invention provides a microelectronic assembly 20 (FIG. 1) having composite conductive elements 22. The microelectronic assembly 20 preferably includes a first microelectronic element 24, such as a semiconductor chip, having a plurality of contacts 26 on a front face 28 thereof. The assembly 20 also includes a second microelectronic element 30, such as a flexible dielectric film, having first contacts 32 on a first surface 34 thereof. The dielectric film 30 may also have second contacts 36 on a second surface 38 thereof which are in registration with the first contacts 32. A plurality of the composite conductive elements 22 are preferably provided over the contacts 32 on the first surface 34 of the dielectric film 30. Each composite conductive element 22 desirably includes a core 40 which is preferably in the shape of a sphere. The core 40 may include a conductive material, such as metal, or a dielectric (non-conductive) material, such as an elast...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional application of U.S. patent application Ser. No. 09 / 942,363, filed Aug. 29, 2001, which application is a divisional application of U.S. patent application Ser. No. 09 / 243,860 filed Feb. 3, 1999, which in turn claims benefit of the filing date of U.S. Provisional Patent Application No. 60 / 073,520, filed Feb. 3, 1998, the disclosures of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION [0002] The present invention relates to components and methods for mounting and connecting microelectronic elements such as semiconductor chips. [0003] Complex microelectronic devices such as semiconductor chips require numerous connections with other electronic components. Typically such semiconductor chips are mounted on external substrates such as printed circuit boards by electrically interconnecting contacts on the semiconductor chip with contact pads on the substrate. The substrate may include inter...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/56H01L23/498H05K1/14H05K3/34
CPCH01L21/563H01L23/49816H01L2924/00013H01L24/16H01L24/81H01L2224/13099H01L2224/73203H01L2224/812H01L2224/81801H01L2924/01027H01L2924/01029H01L2924/01039H01L2924/01049H01L2924/01082H01L2924/3011H05K1/0271H05K1/141H05K1/147H05K1/189H05K3/3436H05K2201/0133H05K2201/10234H05K2201/10378H05K2201/10977H05K2203/128H01L2924/01005H01L2924/01006H01L2924/01033H01L2924/014H01L2224/16238H01L2224/29099H01L2224/05568H01L2224/05573H01L2924/00014Y02P70/50H01L2224/05599
Inventor SMITH, JOHN W.
Owner TESSERA INC