Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw
a technology of dynamic control and dicing saw, which is applied in the field of manufacturing of semiconductor devices, can solve the problems of high cost, complicated sawing, and slow individual semiconductor devices, and achieve the effect of reducing the time required to dice a wafer and improving the throughput of the wafer
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[0028] The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout. Furthermore, the various layers and regions illustrated in the figures are illustrated schematically. As will also be appreciated by those of skill in the art, while the present invention is described with respect to semiconductor wafers and diced chips, such chips may be diced into arbitrary sizes. Accordingly, the present invention is not limited to the relative size and spacing illustrated in the accompanying figures.
[0029] As will be appreciated by one of skill in the art, the present invention may be embodied a...
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