Semiconductor test device with heating circuit

Abstract

A semiconductor test device includes a test circuit having contacts for applying an electrical signal and measuring electrical parameters of the test circuit. The semiconductor test device also includes an integrally formed heating circuit comprising at least one circuit meander positioned adjacent the test circuit for raising a temperature within a portion of the test circuit.

Description

FIELD OF THE INVENTION [0001] The invention is generally related to the field of semiconductor devices and, more particularly, to a semiconductor wafer having an integrally formed heating element. BACKGROUND OF THE INVENTION [0002] A well-known problem area affecting semiconductor reliability is thermal reliability. Consequently, thermal analysis is an important part of testing semiconductor devices. In particular, measurements of cyclic thermal loading on interconnect behavior, such as thermal fatigue and Joule heating that affect the known phenomena of electro-migration and stress migration of interconnects, are necessary to assess reliability of a semiconductor circuit. Conventional techniques for assessing the reliability of a semiconductor circuit include assembling the circuit in a ceramic or similar package, heating the package using external heating sources such as by placing the package in a temperature controlled chamber, applying heat to the package, while applying a dire...

AI Technical Summary

Problems solved by technology

A well-known problem area affecting semiconductor reliability is thermal reliability.

However, conventional thermal fatigue testing of a semiconductor circuit may become excessively time consuming due to the amount of time required to heat the circuit using external sources.

For example, it may be difficult to ramp temperatures up and down as quickly as would be commonly experienced by a semiconductor device being used in the field.

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