Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment
a technology of conductive pattern and wiring substrate, which is applied in the direction of conductive pattern formation, liquid/solution decomposition chemical coating, and conductive pattern formation, etc., can solve the problems of conductive pattern being easily peeled off from the substrate, the electroless plating method involves, and the conductive pattern cannot be sufficiently adhered to the substrate. , to achieve the effect of high reliability
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first embodiment
[0059] Hereinbelow, a description will be made with regard to the first embodiment of the conductive pattern forming method according to the present invention.
[0060]FIG. 2(a) to FIG. 2(g) are illustrations which show steps for forming a conductive pattern according to the fist embodiment of the present invention. In the following description, an upper side in FIGS. 2(a) to FIG. 2(g) is referred to as “upper” or “top” and a lower side in these figures is referred to as “lower” or “bottom”.
[0061] The conductive pattern forming method shown in FIG. 2(a) to FIG. 2(g) include a metallic core formation step (1A) and a plating layer formation step (2A). Hereinbelow, these steps will be explained in this order.
[0062] First, as shown in FIG. 2(A), a substrate 2 on which a conductive pattern 3 is to be formed is prepared. As for the substrate 2, various types of substrates can be used. Examples of such substrates include non-metallic substrates such as silicon wafer, silica glass substrate...
second embodiment
[0111] Next, a description will be made with regard to a second embodiment of the conductive pattern forming method according to the present invention.
[0112]FIG. 3(a) to FIG. 3(c) are illustrations which show steps for forming a conductive pattern according to a second embodiment of the present invention. In the following description, an upper side in FIGS. 3(a) to FIG. 3(c) is referred to as “upper” or “top” and a lower side in these figures is referred to as “lower” or “bottom”.
[0113] The following description concerning the conductive pattern forming method according to the second embodiment of the present invention will focus on the difference from the conductive pattern forming method of the first embodiment, and the common descriptions will be omitted.
[0114] Namely, the second embodiment is the same as the first embodiment excepting that a primary layer 4 is formed prior to the formation of the metallic core 31. The conductive pattern formation method shown in FIG. 3(a) to ...
example 1
[0165] At first, a metallic core formation material was prepared. As for the metallic core formation material, a solution in which silver particles having the average particle size of about 5 nm are dispersed in an organic solvent (“PERFECT SILVER”, product of ULVAC Materials, Inc.) was prepared, but its dispersant, that is the organic solvent was changed to tetradecane.
[0166] In the above metallic core formation material, the amount of the silver particles was 60 wt % and the viscosity was 8 mPa·s, and the surface tension was 0.05 N / m.
[0167] The metallic core formation material was ejected onto a glass substrate using an ink-jet printer head manufactured by SEIKO EPSON Corporation so as to draw a pattern as shown in FIG. 1. In this regard, it is to be noted that the ink-jet printer head was obtained by modifying an ink-jet printer head of a printer PM950C (manufactured and sold by SEIKO EPSON Corporation) so as to be able to stand for organic solvents.
[0168] Next, the metallic c...
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Abstract
Description
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