"run-to-run control system and operating method of the same"

Abstract

A run-to-run control system and a run-to-run controlling method are proposed. The tool process parameters are real-time collected during the semiconductor process is performed and are regarded as the effective factors in the process for providing an optimal operation variables to the tool for the next process run. After modeling the metrology parameters with a set of the tool process parameters with respect to the semiconductor process for its corresponding process run, a set of optimal operation variables is determined by the controller and output to the tool to modify the process recipe of the process. Hence, the process recipe is real-time changed with the process environment to obtain the optimal process performance.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of Invention [0002] The present invention relates to a control system and a method for operating the system. More particularly, the present invention relates to a run-to-run control system and a run-to-run controlling method. [0003] 2. Description of Related Art [0004] Currently, in the semiconductor process, a metrology process for checking the process performance is performed every several process runs. The metrology process includes several measurement categories, such as thickness, depth, uniformity, critical dimension, defect count, film quality etc. When the result of the metrology process of the current tool shows that the process performance is abnormal, a feed-back signal is transmitted to the process controller of the current tool to modify the current process recipe in order to adjust the process performance to be normal. Sometimes, if the performance shifting of the current tool is not serious, a feed-forward signal is transmit...

AI Technical Summary

Benefits of technology

"The present invention provides a run-to-run control system and method for controlling a tool to perform semiconductor processes. The system and method allow for real-time control of the tool based on the current process run and the metrology parameters of previous process runs. By using a multi-variable modeling function and applying control rules, the system can provide optimal operation variables for the tool for each process run, ensuring optimal performance of the process. The method also includes steps of real-time collecting and characterizing process parameters, determining a modeling set based on the metrology parameters and corresponding tool process parameters, and providing a feed-forward signal from a second tool for the second process run. The technical effects of the invention include improved process performance and efficiency, reduced process development time, and improved process control during semiconductor manufacturing."

Problems solved by technology

However, the metrology process is not performed for every process run of each wafer since it takes long time to perform the metrology process.

Therefore, the modified process recipe is not the optimal process recipe for the current tool to perform the current semiconductor process on that moment.

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