Wiring board, multilayer wiring board, and method for manufacturing the same

a wiring board and multi-layer technology, applied in the manufacture of printed circuits, printed circuit aspects, basic electric elements, etc., can solve the problems of reducing size and thickness, reducing difficulty in mounting electronic components, so as to improve the degree of flexibility in design, increase the mounting density of components on the conductive layer surface, and the effect of compactness
US20060249833A1Inactive Publication Date: 2006-11-09THE FUJIKURA CABLE WORKS LTD
12 Cites 3 Cited by

Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
THE FUJIKURA CABLE WORKS LTD
Publication Date
2006-11-09
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A method for manufacturing a wiring board comprising an insulating member, comprising: a penetrating hole formation process of forming a penetrating hole in the insulating member; a placement process of inserting a conductive connecting particle into the penetrating hole; a connecting particle pressing process of disposing the conductive layers on both surfaces of the insulating member, pressing the conductive layers toward the connecting particle in the penetrating hole, and deforming the connecting particle in the pressing direction to obtain the connecting member; and a patterning process of patterning the conductive layers, wherein, in the connecting particle pressing process, the pressing is performed such that the cross-sectional area in the direction along the insulating member surface of at least a portion of the connecting member is greater than the contact area of the connecting member with the conductive layers.
Need to check novelty before this filing date? Find Prior Art

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a wiring board in which conductive layers are formed on both surfaces of an insulating member, a multilayer wiring board in which an outer-layer wiring substrate is stacked onto at least one side of a wiring board, and a method for manufacturing these boards.

[0003] Priority is claimed from Japanese Patent Application No. 2005-110653, filed Apr. 7, 2005, the content of which is incorporated herein by reference.

[0004] 2. Description of the Related Art

[0005] FIG. 27 shows an example of a conventional multilayer wiring board. In the multilayer wiring board shown in this figure, outer-layer wiring substrates 110 are formed on both sides of the wiring board 100A.

[0006] In the wiring board 100A, conductive layers 102 are formed on both sides of the insulating member 101 having a penetrating hole (through-hole) 103. Openings are formed in the conductive layers 102 at positions correspondi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More