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Plasma control using dual cathode frequency mixing

a technology of cathode frequency mixing and plasma control, which is applied in the direction of coatings, chemical vapor deposition coatings, electric discharge tubes, etc., can solve the problems of non-uniformity of etched substrate surface, negative impact of spatial variant effect on process uniformity, etc., and achieve the effect of improving the processing chamber of semiconductor substrates

Inactive Publication Date: 2007-01-04
APPLIED MATERIALS INC
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Problems solved by technology

This spatially variant effect has a negative impact on process uniformity.
For example, in an etch reactor, the standing wave effect can cause non-uniformity in the etched substrate surface.

Method used

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Embodiment Construction

[0015] The present invention generally relates to semiconductor substrate processing in plasma enhanced processing chambers. More specifically, the present invention is a method and apparatus for controlling the characteristics of a plasma formed in a plasma enhanced processing chamber. Characteristics of the plasma which may be controlled include, but are not limited to, the power distribution within the plasma, and the ion energy distribution within the plasma and incident on the workpiece. These plasma characteristics may be controlled via a dual frequency cathode with ratio control in a plasma enhanced processing chamber.

[0016] Examples of plasma enhanced semiconductor processing chambers that may be adapted to benefit from the present invention include the eMaX™, MXP®, and ENABLER™ processing chambers, all available from Applied Materials, Inc. of Santa Clara, Calif. The eMaX™ processing chamber is described in U.S. Pat. No. 6,113,731, issued Sep. 5, 2000 to Shan et al. The MX...

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Abstract

A method and apparatus for controlling characteristics of a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method comprises supplying a first RF signal to a first electrode disposed in a processing chamber, and supplying a second RF signal to the first electrode, wherein an interaction between the first and second RF signals is used to control at least one characteristic of a plasma formed in the processing chamber.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This application is a divisional of co-pending U.S. patent application Ser. No. 10 / 823,364, filed Apr. 12, 2004, which claims benefit of U.S. Provisional Application No. 60 / 514,993 filed Oct. 28, 2003. Each of the aforementioned related patent applications is herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention generally relates to plasma control in a semiconductor substrate processing system and, more particularly, to plasma control using a dual cathode frequency mixing technique. [0004] 2. Description of the Related Art [0005] The increase in size of plasma enhanced semiconductor processing chambers contributes to a spatially variant effect over the surface of the substrate being processed. That is, as the size of the substrate being processed approaches the wavelength of the frequency that is used to bias the substrate, a spatial variation in the ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23F1/00C23C16/00H01L21/3065H01J37/32
CPCH01J37/32165H01J37/32082H01L21/3065
Inventor SHANNON, STEVEN C.GRIMARD, DENNIS S.PANAGOPOULOS, THEODOROSHOFFMAN, DANIEL J.CHAFIN, MICHAEL G.DETRICK, TROY S.PATERSON, ALEXANDERLIU, JINGBAOSHIN, TAEHOPU, BRYAN Y.
Owner APPLIED MATERIALS INC
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