Disclosed in the present application are a
semiconductor processing device, an ignition-of-
plasma control method and a related apparatus. In the
semiconductor processing device, during ignition of
plasma, a
processing gas is first supplied to a processing chamber, and a direct-
current voltage is applied to a target
electrode, so as to form a target
electric field; and the target
electric field is used to accelerate charged particles, such that the free charged particles in the processing chamber obtain energy and then bombard the processing gas to form a first
plasma, thereby completing a pre-ignition-of-plasma process. In an
initial phase of plasma
discharge, electrons having relatively
high energy are mainly required. Therefore, by means of using the target
electric field, which is formed by the direct-
current voltage, to accelerate the charged particles, the charged particles can obtain relatively
high energy, thereby facilitating an improvement in the success rate of ignition of plasma. In addition, other hardware structures, such as a matcher, are not required when the direct-
current voltage is applied to the
electrode, thereby having the characteristics of simplicity and ease of implementation. Once pre-ignition-of-plasma is completed, the application of the direct-current
voltage to the target
electrode can be stopped, and
radio frequency power is supplied to the processing chamber, thereby completing a full ignition-of-plasma and processing process.