Alternating asymmetrical plasma generation in a process chamber

a plasma generation and process chamber technology, applied in the field of plasma processing systems, can solve the problems of increasing the ion density in places, affecting so as to improve the uniformity of the plasma process
US20080023443A1Inactive Publication Date: 2008-01-31PATERSON ALEXANDER +6
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
PATERSON ALEXANDER
Publication Date
2008-01-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

Embodiments of the invention generally provide etch or CVD plasma processing methods and apparatus used to generate a uniform plasma across the surface of a substrate by modulation pulsing the power delivered to a plurality of plasma controlling devices found in a plasma processing chamber. The plasma generated and / or sustained in the plasma processing chamber is created by the one or more plasma controlling devices that are used to control, generate, enhance, and / or shape the plasma during the plasma processing steps by use of energy delivered from a RF power source. Plasma controlling devices may include, for example, one or more coils (inductively coupled plasma), one or more electrodes (capacitively coupled plasma), and / or any other energy inputting device such as a microwave source.
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Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a divisional of U.S. patent application Ser. No. 11 / 060,980, filed Feb. 18, 2005 which claims benefit of provisional U.S. Patent Application Ser. No. 60 / 566,718, filed Apr. 30, 2004, entitled “Alternating Asymmetrical Plasma Generation In A Process Chamber,” [Attorney Docket No. 8459L] which are incorporated by reference.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] Embodiments of the invention generally relate to plasma processing systems and materials and apparatus for controlling plasma uniformity in plasma processing systems.

[0004] 2. Description of the Related Art

[0005] Plasma chambers are regularly utilized in various electronic device fabrication processes, such as etching processes, chemical vapor deposition (CVD) processes, and other processes related to the manufacture of electronic devices on substrates. Many ways have been employed to generate and / or control the plasma density, sha...

Claims

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