Method for polishing diamond wafers
a diamond wafer and polishing technology, applied in the direction of cutting machines, manufacturing tools, edge grinding machines, etc., can solve the problems that diamond wafers with surface roughness of several micrometers are not applicable to compact micro-electronic devices, and the conventional cmp is not capable of polishing diamond films, so as to reduce cost and time
Inactive Publication Date: 2007-02-08
ARROW INT INC +1
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AI Technical Summary
Benefits of technology
The present invention provides a method for polishing diamond wafers using a first transmission device to drive a diamond wafer moving towards a rotating metal disc such that the metal disc polishes the surface of the diamond wafer. The method aims to reduce cost and time. The technical effect of the invention is to provide a more efficient and cost-effective method for polishing diamond wafers.
Problems solved by technology
However, for diamond wafers, i.e., wafers with a diamond film on the surface, conventional CMP is not capable of polishing the diamond film due to its physical and chemical properties.
Therefore, diamond wafers with surface roughness of several micrometers are not applicable to compact micro-electronic devices.
Method used
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Embodiment Construction
[0016] The present invention providing a method for polishing diamond wafers can be exemplified by the preferred embodiment as described hereinafter.
[0017] As shown in FIG. 2, the method for polishing diamond wafers according to the present invention starts with providing at least a diamond wafer 30 on a plate 32 with wax disposed therebetween and fixing the diamond wafer 30 onto the plate 32 using a pressure. Referring to FIG. 3, the plate 32 mounted with the diamond wafer 30 is fixed on a first transmission device 36 of a polishing machine 34 using a vacuum. The first transmission device 36 is controlled by a control unit 38 so as to drive the plate 32 and the diamond wafer 30 to rotate, move back and forth and move perpendicularly to a direction towards a metal disc 40 driven by a second transmission device 42 to rotate unmoved. The control unit 38 has input polishing parameters so as to control the first transmission device 36 and the second transmission device 42 for determini...
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Abstract
A method for polishing diamond wafers. At least a diamond wafer is mounted onto a ceramic plate with wax disposed therebetween and is pressed onto the ceramic plate. The ceramic plate is fixed on a first transmission device of a polishing machine by a vacuum. The ceramic plate is driven by the first transmission device to rotate and move towards a metal disc fixed on a second transmission device driven to rotate unmoved such that the diamond wafer on the ceramic plate is being polished by the metal disc. The method for polishing diamond wafers of the present invention uses the metal disc so as to reduce cost, time and improve polishing efficiency.
Description
BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention generally relates to a method for polishing diamond wafers and, more particularly, to a method using a metal disc so as to polish diamond wafers. [0003] 2. Description of the Prior Art [0004] In semiconductor manufacturing, surface flatness has become crucial because of the demand for high integrity of an integrated circuit (IC). More specifically, chemical mechanical polishing (CMP) is one of the most important techniques used for surface flatness of semiconductor wafers. [0005] Please refer to FIG. 1, which is a schematic diagram illustrating a conventional CMP process. In FIG. 1, a polishing head 10 uses the atmosphere pressure to suck a wafer 12 on the backside such that the surface of the wafer 12 faces a polishing pad 14 and is polished. In order to avoid the polishing head 10 to contact the wafer 12 leading to the damage of the wafer 12, a buffer pad 16 comprising a plurality of vent hol...
Claims
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IPC IPC(8): B24B7/30
CPCB24B37/042B24B9/16
Inventor HSU, CHIH-MING
Owner ARROW INT INC