Treating method for probes positioned on a test card

Inactive Publication Date: 2007-06-21
WANG CHIH CHUNG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0006] The purpose of the invention is to offer a treating method for probes positioned on a test card, increasing electrical conductivity, reducing wear and dirt and residue possible to stick on a tip and the surface of the shank of probes so the probes may be easily repaired and repeatedly used, having a long service life, and at same time boosting effectiveness of the probes.

Problems solved by technology

Generally speaking, the probes 13 may wear by frequent contacts with testees 19, and the wear may affect seriously dependability of the testing and the service life of the test card 1.
Besides, the probe 13 may shorten gradually after frequently polished or ground and finally become too short to be used and to be discarded, resulting in a substantive loss.

Method used

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  • Treating method for probes positioned on a test card
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  • Treating method for probes positioned on a test card

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0029] a treating method for probes positioned on a test card in the present invention, as shown in FIG. 4, includes six steps.

[0030] Probes 2 positioned on a test card are made of tungsten or tungsten alloy having rigidity and electric conductivity, as shown in FIG. 5A.

[0031] The first step is to cover the test card and the surfaces of shanks 22 of the probes 2, only exposing tips 21 of the probes 2.

[0032] The second step is to place the test card and the probes 2 in a plating device, and the plating device is vacuum plating cell.

[0033] The third step is to plate a conductive layer of film 3 on the surfaces of the uncovered tips 21 of the probes 2 for protection, as shown in FIG. 5B.

[0034] The fourth step is to repair or grind even the surfaces of the probes 2 being worn after the probes 2 are used, by removing the dirt and residue 31 on the surface of the film 3 and grinding or repairing, as shown in FIGS. 5C and 5D.

[0035] The fifth step is to cover the test card and the shan...

second embodiment

[0037] Next, a treating method for probes positioned on a test card in the present invention, as shown in FIG. 6, includes four steps, applied to the probes on the test card used and worn down, as shown in FIG. 5C.

[0038] The first step is to repair or grind even the surfaces of the probes 2; first clean dirt and residue 31 remained on the surface of the layer of film 3, and then grind or repair it smooth, as shown n FIG. 5D.

[0039] The second step is to cover the test card and portions of the probes 2 not to be plated, only exposing the surfaces of portions of the probes 2 to be plated.

[0040] The third step is to place the test card and the probes 2 in a plating device, and the plating device is a vacuum electric plating cell.

[0041] The fourth step is to plate a conductive layer of film 32 on the surfaces of the uncovered portions of the probes 2 for protection, as shown in FIG. 5E.

[0042] The materials of the layers of film 3 and 32 are not the same according to the objects or th...

third embodiment

[0045] Next, a treating method for probes positioned on a test card in the present invention, as shown in FIGS. 7 and 8, is designed for preventing electric interference between the probes 2 and short circuit caused by exterior matters falling on the probes 2, including six steps to be described below.

[0046] The first step is to cover the shanks 22 of the probes 2, only exposing the tips 21 of the probes 2.

[0047] The second step is to place the probes 2 in a plating cell, and the plating device is a vacuum plating cell.

[0048] The third step is to plate a conductive layer of film 3 on the uncovered tips 21 of the probes 2.

[0049] The fourth step is to cover the plated tips 21 of the probes 2 and let the shanks 22 of the probes 22 exposed out.

[0050] The fifth step is to place the probes 2 in a plating device again.

[0051] The sixth step is to plate an insulating and nonconductive layer of film 4 on the uncovered surfaces of the shanks 22 of the probes 2 for insulating protection.

[...

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PUM

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Abstract

A treating method for probes positioned on a test card includes several steps for plating a layer of film of various materials according to different necessities on the tips or the portions of the probes before or after the probes on the test card is used, so that the tips of the probes may be repaired and plated again and again to let the probes increase their electric conductivity or insulating property and preventing electromagnetic interference. The materials of the layer of film may be metal, metal alloy or nonmetals.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] This invention relates to a treating method for probes positioned on a test card, particularly to one for plating a layer of film on the tips or the shanks of probes positioned on a test card, and the film material may be a metal, a metal alloy or a non-mental material depending on different necessities, so the probes may be repaired or not attract much dirt and residue, upgrading electric conductivity or insulating property, and preventing electromagnetic interference from occurring. [0003] 2. Description of the Prior Art [0004] Common testees such as chip discs, IC, DRAM, etc. are to be tested by a tester to find whether they possess the designed capability features required or not. Then unqualified products may be eliminated to secure the quality of the products to be sold or used. A test card 1 used for testing is shown in FIGS. 1 and 2, provided with a circuit board 11, a position base 12 mounted on the circuit...

Claims

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Application Information

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IPC IPC(8): C25D5/02
CPCC25D5/022G01R1/06738G01R3/00
Inventor WANG, CHIH-CHUNGLU, WEN-YU
Owner WANG CHIH CHUNG
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