Thermoelectric cooling apparatus

Abstract

A thermoelectric cooling apparatus is described. The thermoelectric cooling apparatus includes a heat-dissipating barrel, a wind guide, cooling fins, and a guiding fan. The heat-dissipating barrel further includes a thermoelectric chip cooling module and heat-dissipating fins disposed therein to remove the heat exchanged by the thermoelectric chip cooling module. One end of the wind guide is coupled to a heat source of an electronic device, for example, a CPU or a graphic chip of a computer. Another end of the wind guide is coupled to the cooling fins coupled to the thermoelectric chip cooling module. The guiding fan drives air passing through the cooling fins to reduce a temperature thereof and blowing to the heat source to reduce the operating temperature thereof.

Description

RELATED APPLICATIONS[0001]The present application is based on, and claims priority from, Taiwan Application Serial Number 95203659, filed Mar. 6, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.FIELD OF THE INVENTION[0002]The present invention generally relates to a thermoelectric cooling apparatus. More particularly, this invention relates to a thermoelectric cooling apparatus for a computer system.BACKGROUND OF THE INVENTION[0003]The information technology and the computer industry are technologically highly developed and the semiconductor manufacturing processes have very advanced requirements. Therefore, the electric circuit layouts of semiconductors have become more complicated and more sophisticated. Complicated and sophisticated semiconductors have higher power consumption, which results in an increase in the operating temperature thereof.[0004]However, semiconductor electronic components are used extensively in computer products, comm...

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Benefits of technology

[0014]The thermoelectric cooling apparatus according to the present invention can suck the air outside the electronic device and cool the air with the thermoelectric chip cooling module. In addition, using the wind guide conducts the air to directly reduce the operating temperature of the high power integrated circuits, for example, a CPU

Problems solved by technology

Therefore, the electric circuit layouts of semiconductors have become more complicated and more sophisticated.

Complicated and sophisticated semiconductors have higher power consumption, which results in an increase in the operating temperature thereof.

The high operating temperature can cause instabilities in a working system.

Furthermore, if the operating temperature is too high, the perfor

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