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Mounting assembly and electronic device with the mounting assembly

a technology of mounting assembly and mounting assembly, which is applied in the direction of electrical apparatus construction details, instruments, solid-state devices, etc., can solve the problems of heat sink, osmosis of grease from the contact between the elastic member and the circuit component,

Inactive Publication Date: 2008-03-20
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a mounting assembly for cooling a heat emitter mounted on a substrate, which can be used in electronic devices such as portable computers. The mounting assembly includes a substrate, a first heat sink, a first heat emitter, first and second thermally conductive grease, and a coupling mechanism. The first heat emitter is interposed between the substrate and the first heat sink, while the second heat emitter is interposed between the first heat sink and a second heat emitter. The first and second thermally conductive grease are used to thermally couple the first and second heat emitter to the first heat sink. The mounting assembly can effectively cool the heat emitter and maintain thermal contact between them, even if there is a large change in the gap between the substrate and the heat sink. The patent text also describes an electronic device that includes the mounting assembly.

Problems solved by technology

However, if a large change in the gap occurs, and excessive pressure is exerted on the thermally conductive grease and elastic member, the grease may ooze from the contact of the elastic member and circuit components or heat sink.

Method used

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  • Mounting assembly and electronic device with the mounting assembly
  • Mounting assembly and electronic device with the mounting assembly
  • Mounting assembly and electronic device with the mounting assembly

Examples

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first embodiment

[0018]Referring to FIGS. 1 to 7, a description will be given of an electronic device which employs a mounting assembly according to the invention. A portable computer 11 as an electronic device example comprises a main unit 12, display unit 13, and hinges 14 provided between the main unit 12 and display unit 13. The hinges 14 are support the display unit 13 so that the display unit 13 can rotate. The display unit 13 includes a display 15.

[0019]The main unit 12 includes a resin housing 21, keyboard 22, touch pad 23 as a pointing device, and button 24.

[0020]As shown in FIGS. 1 and 2, a mounting assembly 25 is contained in the housing 21. As shown in FIGS. 3 to 5, the mounting assembly 25 includes a substrate 31, first heat sink 32, first heat emitter 33, second heat emitter 34, first thermally conductive grease 35, second thermally conductive grease 36, second heat sink 37, coupling mechanism 38 and back plate 39. The substrate 31 is a printed wiring board formed of wiring layers sta...

second embodiment

[0051]In the second embodiment, the heat emitted by the first heat emitter 33 is transmitted to the heat pipe 46 and cooling fin via the first thermally conductive grease 35, the flat plate 71A of the metal fitting 71, the thermally conductive sheet 72 and the heat sink plate 83. The cooling fin discharges the heat to the atmosphere.

[0052]In the second embodiment, the mounting assembly 81 incorporates the second heat sink 37, which thermally couples the first heat sink 82 to the first thermally conductive grease 35, and is vertically movable relative to the first heat sink 82. Accordingly, even when the gap 29 between the substrate 31 and first heat sink 82 must be adjusted for some reason, the second heat sink 37 can absorb a change in the gap 29 and maintain the thermal coupling between the substrate 31 and first heat sink 82. Further, even when an external force is exerted, the second heat sink 37 absorbs the force, thereby preventing a high load from being exerted on the first t...

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PUM

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Abstract

According to one embodiment, a mounting assembly according to the invention comprises a substrate, a first heat sink, a coupling mechanism, a first heat emitter, a second heat emitter, first thermally conductive grease, second thermally conductive grease, and a second heat sink. The first heat emitter and the second heat emitter are mounted on the substrate between the substrate and the first heat sink. The first thermally conductive grease thermally couples the first heat sink to the first heat emitter. The second thermally conductive grease thermally couples the first heat sink to the second heat emitter. The second heat sink is vertically movable relative to the first heat sink.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2006-251606, filed Sep. 15, 2006, the entire contents of which are incorporated herein by reference.BACKGROUND[0002]1. Field[0003]One embodiment of the invention relates to a mounting assembly capable of cooling a heat emitter mounted on a substrate, and an electronic device incorporating the mounting assembly.[0004]2. Description of the Related Art[0005]Jpn. Pat. Appln. KOKAI Publication No. 2004-247724, for example, discloses a mounting assembly to cool circuit components. This mounting assembly comprises a substrate, a plurality of circuit components mounted on the substrate, a heat sink covering the upper surfaces of the circuit components so as to be in thermal contact with them, and a thermally conductive material provided below the heat sink around the circuit components. In the mounting assembly, the heat emitted by the circuit c...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K7/20
CPCG06F1/203H01L2924/0002H01L2924/00
Inventor IIKUBO, TAKASHI
Owner KK TOSHIBA