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Heat sink

a heat sink and heat sink technology, applied in lighting and heating apparatus, semiconductor devices, semiconductor/solid-state device details, etc., can solve the problems of low heat dissipation performance of heat sinks, inability to meet actual heat dissipation requirements, and large heat sinks. achieve the effect of improving heat dissipation performan

Inactive Publication Date: 2009-06-18
HUANG TSUNG HSIEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]According to still another aspect of the present invention, heat pipes may be fastened to the base panel and the radiation fins to en

Problems solved by technology

These heat sinks have low performance in heat dissipation.
They cannot satisfy actual heat dissipation requirements.
However, these heat sinks are big in size, complicated, and expensive, therefore not practical for use in situations where lower heat dissipation power is required.
In conclusion, conventional heat sinks cannot fit different heat dissipation requirements.

Method used

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Embodiment Construction

[0034]Referring to FIGS. 1 and 2, a heat sink in accordance with the present invention comprises a base panel 1 and a plurality of radiation fins 2.

[0035]The base panel 1 is a flat metal member made of an excellent heat conduction metal material (for example, aluminum or copper, i.e., the so-called aluminum base or copper base), having a plurality of heat dissipation columns 11 perpendicularly upwardly extending from its top wall. The heat dissipation columns 11 are arranged on the top side of the base panel 1 either in a regular or irregular manner. According to this embodiment, the heat dissipation columns 11 are arranged in an array. The radiation fins 2 have mounting through holes 21 respectively and tightly fastened to the heat dissipation columns 11 in such a manner that the radiation fins 2 are firmly supported on the heat dissipation columns 11 at different elevations in a parallel manner.

[0036]By tightly fastening the mounting through holes 21 of the radiation fins 2 to the...

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PUM

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Abstract

A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall, and radiation fins mounted on the heat dissipation columns at different elevations, each radiation fin having a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns. The base panel may be provided with a fan and / or heat pipes to enhance heat dissipation efficiency.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to a heat sink for dissipation of heat from a semiconductor heat source and more particularly to a heat sink, which comprises a base panel having upright heat dissipation columns, and radiation fins with mounting through holes mounted on the heat dissipation columns at different elevations. The base panel of the heat sink may be provided with a fan and / or heat pipes to enhance heat dissipation efficiency.[0003](b) Description of the Prior Art[0004]Conventional heat sinks are commonly comprised of a flat base panel and a plurality of radiation fins directly bonded to the base panel. Heat pipes may be bonded to the base panel to enhance heat dissipation performance. The base panel and the radiation fins are commonly extruded from aluminum or copper. The radiation fins are arranged on the base panel and spaced from one another at a distance. The base panel transfers heat energy from the semic...

Claims

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Application Information

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IPC IPC(8): F28F7/00
CPCH01L23/3672H01L23/3677H01L23/467H01L2924/0002H01L2924/00
Inventor HUANG, TSUNG-HSIEN
Owner HUANG TSUNG HSIEN