Heat exchange device

Abstract

A heat exchange device includes a heat exchanger disposed in connection with at least one of a heat-dissipation electrode and a heat-absorption electrode, between which a plurality of thermoelectric elements is connected in series, via an insulating resin layer, which is composed of an epoxy resin or polyimide resin doped with fillers having high thermal conductivity, without intervention of a substrate. The heat exchanger corresponds to a plurality of corrugated fins which are constituted of a plurality of joint regions joining with one of the heat-dissipation electrode and heat-absorption electrode and a plurality of non-joint regions projecting externally from a plurality of gaps formed between the joint regions adjacently aligned together, wherein the joint regions and non-joint regions are alternately aligned. Thus, it is possible to achieve high reliability by reducing thermal resistance and thermal stress while increasing the maximum heat absorption coefficient (Qmax).

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to heat exchange devices including heat exchangers coupled with thermoelectric modules having thermoelectric elements connected in series between heat-dissipation electrodes and heat-absorption electrodes.[0003]The present application claims priority on Japanese Patent Application No. 2008-71723, the content of which is incorporated herein by reference.[0004]2. Description of the Related Art[0005]Conventionally-known thermoelectric modules are designed such that different types of thermoelectric elements composed of P-type and N-type semiconductors are alternately aligned and connected in series between heat-dissipation electrodes and heat-absorption electrodes via bonding metals such as solders. Various techniques have been developed to improve heat dissipation efficiency in thermoelectric modules, wherein heat exchangers are coupled to heat-dissipation substrates or heat-absorption substr...

AI Technical Summary

Benefits of technology

[0012]It is an object of the present invention to provide a heat exchange device which is improved in heat absorption by reducing thermal resistance and which achieves high reliability by reducing thermal stress.

[0014]Since one of the heat-dissipation electrode and heat-absorption electrode is not equipped with a substrate and is thus reduced in thermal resistance, it is possible to increase the maximum heat absorption coefficient (Qmax). The thermoelectric elements are bonded via the insulating resin layer so as to support one of the heat-dissipation electrode and heat-absorption electrode, thus eliminating the necessity of a substrate.

[0015]Thermal stress occurring in the corrugated fins is absorbed by the non-joint regions aligned in the gaps between adjacent joint regions, thus improving reliability against thermal stress. By completely eliminating the necessity of a substrate with respect to both of the heat-dissipation electrode and heat-absorption electrode, it is possible to further reduce thermal resistance, thus further increasing the maximum heat absorption coefficient (Qmax).

[0016]Since the width of the joint region is larger than the width of the gap formed between adjacent joint regions, it is possible to efficiently transmit heat generated by the thermoelectric elements to the corrugated fins, thus improving heat exchange efficiency. It is preferable that the insulating resin layer be composed of a polyimide resin or epoxy resin which is doped with fillers having high thermal conductivity such as alumina powder, aluminum nitride powder, and magnesium oxide powder.

Problems solved by technology

This makes it difficult to sufficiently release thermal stress from the thermoelectric elements 58, thus degrading the reliability of the thermoelectric module 50a against thermal stress.

Images